Simulation of slip band evolution in duplex Ti–6Al–4V

Zhang, M.; Bridier, Florent; Villechaise, Patrick; Méndez, J.; McDowell, David L.

doi:10.1016/j.actamat.2009.10.025

Cited by 64 publications

(41 citation statements)

References 32 publications

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“…However, typically HR-DIC only captures in-plane total strains, and cannot easily track the driving stresses, out of plane strain and residual deformation such as lattice curvature and residual stress. Many of these studies have been largely qualitative in nature [21] and complement analysis of out of plane slip through slip trace analysis [22]. [24], potential to scan large areas, easy access to complementary SEM imaging modes (e.g.…”

Section: *Text Only Click Here To Download Text Only: Manuscript_jun_mentioning

confidence: 99%

Evolution of intragranular stresses and dislocation densities during cyclic deformation of polycrystalline copper

2015

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We have used the cross-correlation based high resolution electron backscattering diffraction (HR-EBSD) technique to evaluate at high spatial resolution the spatial patterning of the type III intragranular residual stresses and geometrically necessary dislocation (GND) density within polycrystalline Cu after cyclic deformation. Oxygen free high conductivity (OFHC) polycrystalline copper samples were cyclically deformed under stress-control at a load ratio of 0.1 and EBSD measurements were made at points throughout the early stages of fatigue when strain amplitudes and cyclic creep rates are changing most significantly, namely at 0 cycles, 2 cycles, 200 cycles and 2000 cycles. Statistical analysis is presented showing that moderate correlations exist between stored GND density, residual intragranular stress and distance from the nearest grain boundaries or/and triple junctions. Ref: Ms.No.A-15-232Manuscript: "Evolution of intragranular stresses and dislocation densities during cyclic deformation of polycrystalline copper" Dear Prof MahajanWe are very pleased to submit our revised manuscript to Acta Materialia for considering publication. Each of referee's comment and suggestion has been carefully addressed. Detailed explanations are included in the 'Response to Reviewer' file. All changes and corrections to our original manuscript have been highlighted in the revised manuscript.We would be very grateful for Editor's effort and time to process our manuscript and very look forward to hearing from you soon. Authors are very grateful to Reviewer's time, effort and constructive comments. In order to comprehensively revise our manuscript and give most appropriate response, we address Reviewer's comments one by one in detail in the following section. (Reviewer's comments are marked using red colour, correction to the manuscript are marked as yellow and Authors responses are marked as blue.Editor's/Reviewer's comments: This paper gives some interesting insights into dislocation and stress development during cyclic testing. Overall the analysis is appropriate, although I was surprised about two things: the correlations reported in the paper are pretty low; I was surprised that the authors did not pursue this a little further to factor out some of the issues (such as substructure development) that appear to play an important role in causing this. Relating to the previous point, the authors mention dislocation substructure development in an extremely cursory and handwaving fashion. They mention correlations with orientation and different types of structure, but in an almost off-handed way that does not even connect with the wealth of literature on the subject. Issue 2. should certainly be fixed, and it would be nice to improve issue 1. a little if possible. I have made comments on the manuscript that I hope will be helpful (including pointing out a few typos).1. These coefficients are low. The correlation coefficients are generally not very high (~-0.2) (That's a bit of a stretch) This is a sensible suggestion and ...

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Section: *Text Only Click Here To Download Text Only: Manuscript_jun_mentioning

confidence: 99%

Evolution of intragranular stresses and dislocation densities during cyclic deformation of polycrystalline copper

2015

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“…To develop predictive models for monotonic and cyclic loading, there is a need for quantitative assessment of the heterogeneous strain fields at the microscopic scale, to better relate the local mechanical behavior to the global loading conditions. Crystal plasticity simulations based upon either molecular dynamics or finite elements are currently being developed to address these microstructuralinfluenced phenomena [3,4] and localization of plasticity along slip bands or persistent slip bands [5]. Experimental data on strain localization via in situ SEM DIC is available [6][7][8][9][10][11][12][13][14] at the microscale, however few experiments [15][16][17] have resolved subgrain strain fields at the scale of the localization of plasticity (slip bands).…”

Section: Introductionmentioning

confidence: 99%

Sub-Grain Scale Digital Image Correlation by Electron Microscopy for Polycrystalline Materials during Elastic and Plastic Deformation

et al. 2015

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Damage during loading of polycrystalline metallic alloys is localized at or below the scale of individual grains. Quantitative assessment of the heterogeneous strain fields at the grain scale is necessary to understand the relationship between microstructure and elastic and plastic deformation. In the present study, digital image correlation (DIC) is used to measure the strains at the sub-grain level in a polycrystalline nickel-base superalloy where plasticity is localized into physical slip bands. Parameters to minimize noise given a set speckle pattern (introduced by chemical etching) when performing DIC in a scanning electron microscope (SEM) were adapted for measurements in both plastic and elastic regimes. A methodology for the optimization of the SEM and DIC parameters necessary for the minimization of the variability in strain measurements at high spatial resolutions is presented. The implications for detecting the early stages of damage development are discussed.

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“…Recent studies compared 2D FE simulations and experimentally observed plastic strain localization [8] or slip traces [9]. Some of the numerical studies were focused on the effect of free surface but without introducing crystal plasticity [10].…”

Section: Introductionmentioning

confidence: 99%

Numerical investigations of the free surface effect in three-dimensional polycrystalline aggregates

Guilhem

Basseville

Curtit³

et al. 2013

Computational Materials Science

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The aim of the present paper is to investigate the consequences of the loading on the free surface response in polycrystalline aggregates. The study is made on a 316L stainless steel. Finite element computations using a crystal plasticity model are performed to simulate a polycrystalline aggregate submitted to different cyclic loadings. A statistical analysis of the results is carried out to extract information concerning the local stress and local strain fields at the free surface. The analysis of plastic strain localization on surface maps and inside the bulk through transparent volumetric views allows to exhibit the effects of the grain orientation and of the loading on local mechanical fields. The computation of an indicator characterizing extrusion/intrusion steps give some information on the initiation sites.

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Simulation of slip band evolution in duplex Ti–6Al–4V

Cited by 64 publications

References 32 publications

Evolution of intragranular stresses and dislocation densities during cyclic deformation of polycrystalline copper

Evolution of intragranular stresses and dislocation densities during cyclic deformation of polycrystalline copper

Sub-Grain Scale Digital Image Correlation by Electron Microscopy for Polycrystalline Materials during Elastic and Plastic Deformation

Numerical investigations of the free surface effect in three-dimensional polycrystalline aggregates

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