2006
DOI: 10.1109/ted.2006.877698
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Simulation of Electron Transport in InGaAs/AlGaAs HEMTs Using an Electrothermal Monte Carlo Method

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Cited by 38 publications
(35 citation statements)
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“…We previously presented results from the application of the electrothermal Monte Carlo (MC) simulator to GaAs MESFETs [3] and InGaAs/AlGaAs HEMTs [4,5]. In this paper, we present results for wurtzite GaN/AlGaN HEMTs.…”
mentioning
confidence: 99%
“…We previously presented results from the application of the electrothermal Monte Carlo (MC) simulator to GaAs MESFETs [3] and InGaAs/AlGaAs HEMTs [4,5]. In this paper, we present results for wurtzite GaN/AlGaN HEMTs.…”
mentioning
confidence: 99%
“…The charge transport model chosen follows an established Monte Carlo approach 18 , our implementation of which we have developed and applied over a number of years [19][20][21][22] and now extended to Ge. Since the SPAD operates in a heavily reverse-biased mode and is essentially depleted of mobile charge except during avalanche, only electron transport is included because the device relies upon these carriers for avalanche triggering in the Si layers.…”
Section: Spad Design and Modelling Approachmentioning
confidence: 99%
“…The electrothermal coupling equations, including the HDE and the related heat generation term, are described in [20]. Each electrothermal Monte Carlo iteration includes a transient period (up to 30 ps) to allow the electronic characteristics to reach steady state, and an equilibrium period (up to 30 ps) where electronic (e.g.…”
Section: Simulation Detailsmentioning
confidence: 99%
“…In such simple geometries, employing 2D solvers based on analytical models or finitedifference meshing is sufficient for a reliable study of the coupled effect of electron transport and heat diffusion. The 2D FD version of the electrothermal Monte Carlo method has been successfully employed to study transport in heterostructure devices based on several material systems, including Si [24,25], III-As [20] and III-N [26][27][28] compounds. Later work on the modeling of advanced structures such as nanowires and nanojunctions involved the use of the 3D FE schemes [29][30][31][32][33][34][35]; for this purpose, substantial efforts have been invested to carefully integrate into our simulator a finite-element package (NETGEN/NGSOLVE [36]) to solve for both Poisson's and the heat diffusion equations.…”
Section: Simulation Detailsmentioning
confidence: 99%