Simplified modeling of parallel plate resonances on multilayer printed circuit boards

Tarvainen, Timo

doi:10.1109/15.865335

Cited by 18 publications

(9 citation statements)

References 12 publications

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“…1. An efficient way of calculating the impedance profile of this structure can be developed based on the 2-D finite-difference method [10], [11]. We make use of the fact that the thickness of the dielectric is much smaller than the lateral dimensions, hence, the variation of the electric and magnetic fields with respect to the vertical z-direction can be neglected.…”

Section: A Analysis Of Power/ground Planes and Decoupling Capacitorsmentioning

confidence: 99%

Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance

Engin

2010

IEEE Trans. Electromagn. Compat.

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This paper presents efficient algorithms for sensitivity calculations of power delivery network (PDN) impedance. The sensitivity algorithm is based on the adjoint system method. Efficient calculation of sensitivity is critical for optimization of complex PDNs. The frequency-domain design of a PDN is a multiobjective optimization problem, which is formulated as a minimax problem in this paper. The design variables are typically the decoupling capacitors (decaps). The objective function is the input impedance of the PDN calculated at relevant frequencies. This paper also presents an efficient algorithm for large-change sensitivity calculations. Based on this method, what-if scenarios can be simulated efficiently, such as the addition, modification, or relocation of a few decaps or a small change in the geometry.

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Section: A Analysis Of Power/ground Planes and Decoupling Capacitorsmentioning

confidence: 99%

Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance

Engin

2010

IEEE Trans. Electromagn. Compat.

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“…Power planes of (or ) and GND pairs can be allocated both with inner or outer layers, but they are usually distributed in the inner two layers. As reported in [5] and [6], the lumped local decoupling capacitors connecting the pins of digital ICs to ground plane often provide a return pass of high frequency energy. A low impedance power distribution network, which consists of the distributed /GND parallel planes and the lumped decoupling capacitors, is the key factor to successfully reduce the ground bounce noise in the high-speed PCB.…”

Section: Impedance Calculation Of Power-bus Plane Using Modified mentioning

confidence: 99%

“…Unfortunately, they usually failed to design reliable power distribution network for practical applications, since the designed power-bus shows some errors on impedance over a wide range of frequencies. Most of the conventional models [5], [6] assume that the capacitors on the PCB are independently connected in parallel between power and ground planes, but this is too rough in the real PCB. Consequently, the current coupling between two measured modes is ignored, which severely degrades the accuracy.…”

Section: Introductionmentioning

confidence: 99%

An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards

Kim

Yoon

Lee

et al. 2004

IEEE Trans. Adv. Packag.

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Abstract-In high-speed printed circuit boards, the decoupling capacitors are commonly used to mitigate the power-bus noise that causes many signal integrity problems. It is very important to determine their proper locations and values so that the power distribution network should have low impedance over a wide range of frequencies, which demands a precise power-bus model considering the decoupling capacitors. However, conventional power-bus models suffer from various problems, i.e., the numerical analyzes require huge computation while the lumped circuit models show poor accuracy. In this paper, a novel power-bus model has been proposed, which simplifies the n-port Z-parameters of a power-bus plane to a lumped T-network circuit model. It exploits the pathbased equivalent circuit model to consider the interference of the current paths between the decoupling capacitors, while the conventional lumped models assume that all decoupling capacitors are connected in parallel, independently with each other. It also models the equivalent electrical parameters of the board parasitic precisely, while the conventional lumped models employ only the inter-plane capacitance of the power-ground planes. Although it is a lumped model for fast and easy calculation, experimental results show that the proposed model is almost as precise as the numerical analysis. Consequently, the proposed model enables a quick and accurate optimization of power distribution networks in the frequency domain by determining the locations and values of the decoupling capacitors.Index Terms-Decoupling capacitors, equivalent circuit model, power-bus distribution network.

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“…A solution proposed to provide a high-performance vertical transition in a multilayer substrate is based on forming a shield via as a result of the conjoint use of signal and ground vias. In this case, a specific coaxial waveguide can be formed in the vertical direction of the multilayer substrate (Pillai, 1997;Tarvainen, 2000;Kushta et al 2002).…”

Section: Shield Via As Vertical Transmission Lines For Multilayer Submentioning

confidence: 99%

Vertical Transmission Lines in Multilayer Substrates and Highly-Integrated Filtering Components Based on These Transmission Lines

Kushta¹

2010

Passive Microwave Components and Antennas

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Simplified modeling of parallel plate resonances on multilayer printed circuit boards

Cited by 18 publications

References 12 publications

Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance

Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance

An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards

Vertical Transmission Lines in Multilayer Substrates and Highly-Integrated Filtering Components Based on These Transmission Lines

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