Simple reflow technique for fabrication of a microlens array in solgel glass

He, Miao; Yuan, Xiaocong; Ngo, Nam Quoc; Bu, Jing; Kudryashov, V. A.

doi:10.1364/ol.28.000731

Cited by 70 publications

(32 citation statements)

References 8 publications

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“…In addition, optical devices, including buried-channel erbium-doped waveguide amplifiers, microlenses, one-dimensional photonic crystal devices and external-cavity distributed Bragg reflector ͑DBR͒ laser have been achieved using the sol-gel method. [6][7][8][9] Here we report a new method to fabricate both erbium-doped microlasers and Raman microlasers on a silicon chip using sol-gel films as the base material for microtoroid formation. In one series of experiments, erbium-doped sol-gel films are used to create low threshold microlasers.…”

mentioning

confidence: 99%

Erbium-doped and Raman microlasers on a silicon chip fabricated by the sol–gel process

Yang¹,

Carmon²,

Min³

et al. 2005

Applied Physics Letters

148

117

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We report high-Q sol-gel microresonators on silicon chips, fabricated directly from a sol-gel layer deposited onto a silicon substrate. Quality factors as high as 2.5ϫ 10 7 at 1561 nm were obtained in toroidal microcavities formed of silica sol-gel, which allowed Raman lasing at absorbed pump powers below 1 mW. Additionally, Er 3+ -doped microlasers were fabricated from Er 3+ -doped sol-gel layers with control of the laser dynamics possible by varying the erbium concentration of the starting sol-gel material. Continuous lasing with a threshold of 660 nW for erbium-doped microlaser was also obtained. Recently, a chip-based silica resonator structure in the form of a microtoroid has demonstrated ultrahigh-Q-factors in the range of 100 million. 1 By coating these high-Q microcavities with erbium-doped sol-gel films 2 or by beginning with erbium implanted silica layers, 3 low threshold rareearth-doped microlasers on-a-chip have been demonstrated. In another study, the realization of integrated Raman microlasers beginning with a layer of thermally-grown silica has been achieved. 4 Microlasers on silicon chips are especially interesting because they are integrable with other optical or electric components. In this work, we demonstrate the possibility of making microlasers directly from the sol-gel layers on the silicon wafer. The sol-gel method for preparing silica and silicate from a metal alkoxide precursor provides a versatile and cost-effective way to fabricate various components on silicon chips. It combines control of composition and microstructure at the molecular level with the ability to shape materials in bulk, fiber, powder, and thin film forms. 5 This technique allows a wide variety of thin films to be deposited on various substrates. In addition, optical devices, including buried-channel erbium-doped waveguide amplifiers, microlenses, one-dimensional photonic crystal devices and external-cavity distributed Bragg reflector ͑DBR͒ laser have been achieved using the sol-gel method. 6-9 Here we report a new method to fabricate both erbium-doped microlasers and Raman microlasers on a silicon chip using sol-gel films as the base material for microtoroid formation. In one series of experiments, erbium-doped sol-gel films are used to create low threshold microlasers. In a second set of experiments, pure silica sol-gel layers are processed into ultrahigh-Q Raman microlasers. Both of these cases demonstrate the ability to use spin coating of sol-gel films as a processing alternative to deposition or oxidation methods for silica layer formation.The sol-gel solution was prepared by hydrolyzing tetraethoxysilane ͑TEOS͒ using water with the molar ratio of water to TEOS around 1-2. Hydrochloric acid was added to make the solution in acid condition. Er 3+ ions were introduced by adding Er͑NO͒ 3 to achieve the desired Er 3+ concentration. After reaction at 70°C for 3 h, a viscous solution was formed. The silica sol-gel film was then deposited on a silicon substrate by the spin-coating method. Different thicknesses of the s...

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mentioning

confidence: 99%

Erbium-doped and Raman microlasers on a silicon chip fabricated by the sol–gel process

Yang¹,

Carmon²,

Min³

et al. 2005

Applied Physics Letters

148

117

View full text Add to dashboard Cite

show abstract

“…Laser ablation, ion-beam milling, and other material microremoving processes have produced optics structures with aspheric surface shapes, [ 3 , 4 ] but are obviously unsuitable for mass application due to the poor cost-effectiveness or the poor surface smoothness which results from the cascaded material removal. Thermal refl ow techniques [5][6][7] and the hot embossing method, [ 8 , 9 ] based on interfacial-tension-induced deformation of the photoresist, solgel glass, or other thermoplastic polymers, have been used to fabricate MLAs of high surface smoothness economically. But these thermal approaches can only be used to fabricate microlenses with convex surfaces and are faced with a diffi culty in controlling the lens surface geometry or focal length.…”

Section: Doi: 101002/adma201104625mentioning

confidence: 99%

Fabrication of Microlens Arrays with Well‐controlled Curvature by Liquid Trapping and Electrohydrodynamic Deformation in Microholes

Ding

Shao

et al. 2012

Advanced Materials

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“…In such packaging, a ball lens is one of the crucial elements relaying light between the edgeemitting components. To date, various ways of producing a micro lens at wafer-level such as thermal reflow of photoresist [4], glass [5], sol-gel glass [6], vacuum-reflow of glass [7], or molding [8,9], have been reported. However, most of these methods produce hemispherical lenses relaying light normal to the wafer, in other words, to surface-sensitive devices such as PDs (photodiode) or VCSELs (vertical cavity surface emitting laser) that are attached to the wafer.…”

Section: Introductionmentioning

confidence: 99%

“…However, glass provides better mechanical, thermal, and chemical properties than the polymer. Therefore, various attempts to produce glass micro-lenses have been studied, although most of these methods produce hemispherical lenses [5][6][7][8][9]. Still, the mushroom-shaped or nearly spherical glass lens has not been reported, especially, for wafer-level application.…”

Section: Introductionmentioning

confidence: 99%

Wafer-level Fabrication of Ball Lens by Cross-cut and Reflow of Wafer-bonded Glass on Silicon

Lee

et al. 2010

Journal of the Optical Society of Korea

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Novel wafer-level fabrication of a glass ball-lens is realized for optoelectronic applications. A Pyrex wafer is bonded to a silicon wafer and cross-cut into a square-tile pattern, followed by wet-etching of the underlying silicon. Cubes of Pyrex on the undercut silicon are then turned into ball shapes by thermal reflow, and separated from the wafer by further etching of the silicon support. Radial variation and surface roughness are measured to be less than ±3 ㎛ and ±1 nm, respectively, for ball diameter of about 500 ㎛. A surface defect on the ball that is due to the silicon support is shown to be healed by using a silicon-optical-bench. Optical power-relay of the ball lens showed the maximum efficiency of 65% between two single-mode fibers on the silicon-optical-bench.

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Simple reflow technique for fabrication of a microlens array in solgel glass

Cited by 70 publications

References 8 publications

Erbium-doped and Raman microlasers on a silicon chip fabricated by the sol–gel process

Erbium-doped and Raman microlasers on a silicon chip fabricated by the sol–gel process

Fabrication of Microlens Arrays with Well‐controlled Curvature by Liquid Trapping and Electrohydrodynamic Deformation in Microholes

Wafer-level Fabrication of Ball Lens by Cross-cut and Reflow of Wafer-bonded Glass on Silicon

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