1998
DOI: 10.1109/22.668681
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SIMMWIC rectennas on high-resistivity silicon and CMOS compatibility

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Cited by 38 publications
(7 citation statements)
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“…Die Verwendung von Silizium-Substraten ermöglicht zusammen mit der Verwendung der SIMMWIC (silicon monolithic mm-wave integrated circuit) Technologie [1] eine kostengünstige Herstellung von HF-Modulen. Dort sind kleine Bauformen und kostengünstige Fertigung bei großen Stückzahlen gefordert.…”
Section: Einführungunclassified
“…Die Verwendung von Silizium-Substraten ermöglicht zusammen mit der Verwendung der SIMMWIC (silicon monolithic mm-wave integrated circuit) Technologie [1] eine kostengünstige Herstellung von HF-Modulen. Dort sind kleine Bauformen und kostengünstige Fertigung bei großen Stückzahlen gefordert.…”
Section: Einführungunclassified
“…Strohm et al reported the successful implementation of rectennas on high-resistivity silicon wafers in [6], but tbe rectennas were used as sensors for the detection of millimeter-wave signals at a frequency of 63 GHz. In [7], integrated dipole antennas on silicon substrates were demonstrated for intra-chip communication, but the distance between the transmitting and receiving antennas was less than 5 em, since they were both on a silicon die of 5.3 cm x 4.1 cm.…”
Section: Introductionmentioning
confidence: 99%
“…Due to its "majority carrier" property [1], the cut-off frequency of schottky diode can be well achieved in THz range [2]. Together with antenna, the rectenna can be realized for wireless RF power detection [3] or energy harvesting applications [4]. In this work, the design and the small signal characterization of a monolithic integrated 85 GHz schottky rectenna are presented.…”
Section: Introductionmentioning
confidence: 99%