Silver localization on polyimide using microcontact printing and electroless metallization

Gout, S.; Coulm, Jérémy; Léonard, Didier; Bessueille, François

doi:10.1016/j.apsusc.2014.04.108

Cited by 23 publications

(9 citation statements)

References 54 publications

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“…Based on this technique, printed electrodes were used to define drain and source contacts of thin‐film transistors . In addition, μCP has been employed to pattern metallic NWs and NPs, yielding electrodes for the application of sensitive strain sensors, large‐area flexible OPVs, flexible flash memory, and so on . The corresponding processes can be mainly divided into two methods: i) printing monolayer resists on metallic films and etching the unprinted regions; and ii) printing seeding solutions for electroless deposition from solutions.…”

Section: Mask‐assisted Nanopatterningmentioning

confidence: 99%

Toward Scalable Flexible Nanomanufacturing for Photonic Structures and Devices

et al. 2016

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Continuous and scalable nanopatterning over flexible substrates is highly desirable for both commercial and scientific interests, but is difficult to realize with traditional photolithographic processes. The recent advancements in nanofabrication methodologies enable light management with photonic structures on flexible materials, providing an increasingly popular strategy to control the light harvesting in the optoelectronic devices of photovoltaics, and in organic and inorganic light-emitting diodes. Here, the current status of nanopatterning technologies for the fabrication of optoelectronic devices is summarized. Scalable nanopatterning technologies for nanomanufacturing on flexible materials are emphasized. Critical challenges in various patterning techniques when considering the resolution, scalability, processing throughput, and the use of masks and resists are addressed. The integration of flexible nanopatterned substrates with light manipulation in organic optoelectronic devices is also discussed; this enables the control of light flux and spectra. Finally, potential development directions are highlighted.

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Section: Mask‐assisted Nanopatterningmentioning

confidence: 99%

Toward Scalable Flexible Nanomanufacturing for Photonic Structures and Devices

et al. 2016

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“…The reduction is an auto-catalytic reaction using pre-printed metal nanoparticles or ions as catalyst seeds. Traditionally, Pd, Pt, and Ag are used as catalyst seeds, − and formaldehyde is employed as the reductant in electroless plating processes …”

Section: Introductionmentioning

confidence: 99%

Electroless Plating Cycle Process for High-Conductivity Flexible Printed Circuits

Zhang

Shi

et al. 2021

ACS Sustainable Chem. Eng.

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In this work, a non-formaldehyde electroless plating cycle process was successfully applied to prepare the flexible copper printed circuits on poly (ethylene terephtalate) (PET) films.Copper nanoparticles (Cu NPs) were employed as catalytic seeds, and dimethylaminoborane (DMAB) was used as the reductant. Cu NPs were directly printed on the PET surface modified by 3mercaptopropyltriethoxysilane (MPTES) to serve as the seeds to trigger the electroless deposition. MPTES modification can dramatically improve the adhesion of the PET and Cu layer. Cu NPs can ideally substitute noble metals Ag, Pt, and Pd to catalyze electroless deposition. DMAB, as an innocuous reductant can replace formaldehyde in an alkalescent plating bath. The amount of Cu NPs with different sizes on the per area of the PET surface was investigated to determine its appropriate dosage. Various times, temperatures, concentrations of reactants in the electroless plating process were researched to obtain optimal deposition. The minimal sheet resistance of the copper pattern was 6 mΩ/sq with a resistivity of 2.01 μΩ•cm, which is 1.18 times that of bulk copper. These results demonstrated that the prepared Cu pattern had excellent conductivity. The kinetics of the electroless plating process was researched to quantify the thickness of the Cu layer and the consumption of reactants. The electroless plating bath can well be cycled after compensating reactants, while the sheet resistance of the Cu pattern fluctuated very little. The cycling electroless plating bath will greatly reduce the discharge of waste and is of vital significance for the large-scale and cheap manufacturing of flexible printed electronics.

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“…No metal catalyst should be present on the a-C:H sacrificial dielectric at the sidewall of the trench. Noncontinuous thin metal films, metal nanoparticles − and reduced metal ions − can be exploited as catalysts for ELD. In this work, ALD Ru is used as selective catalyst for ELD metal growth.…”

Section: Introductionmentioning

confidence: 99%

Selective Ru ALD as a Catalyst for Sub-Seven-Nanometer Bottom-Up Metal Interconnects

Zyulkov

Krishtab

Gendt

et al. 2017

ACS Appl. Mater. Interfaces

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Integrating bottom-up area-selective building-blocks in microelectronics has a disruptive potential because of the unique capability of engineering new structures and architectures. Atomic layer deposition (ALD) is an enabling technology, yet understanding the surfaces and their modification is crucial to leverage area-selective ALD (AS-ALD) in this field. The understanding of general selectivity mechanisms and the compatibility of plasma surface modifications with existing materials and processes, both at research and production scale, will greatly facilitate AS-ALD integration in microelectronics. The use of self-assembled monolayers to inhibit the nucleation and growth of ALD films is still scarcely compatible with nanofabrication because of defectivity and downscaling limitations. Alternatively, in this Research Article, we demonstrate a straightforward H plasma surface modification process capable of inhibiting Ru ALD nucleation on an amorphous carbon surface while still allowing instantaneous nucleation and linear growth on Si-containing materials. Furthermore, we demonstrate how AS-ALD enables previously inaccessible routes, such as bottom-up electroless metal deposition in a dual damascene etch-damage free low-k replacement scheme. Specifically, our approach offers a general strategy for scalable ultrafine 3D nanostructures without the burden of subtractive metal patterning and high cost chemical mechanical planarization processes.

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Silver localization on polyimide using microcontact printing and electroless metallization

Cited by 23 publications

References 54 publications

Toward Scalable Flexible Nanomanufacturing for Photonic Structures and Devices

Toward Scalable Flexible Nanomanufacturing for Photonic Structures and Devices

Electroless Plating Cycle Process for High-Conductivity Flexible Printed Circuits

Selective Ru ALD as a Catalyst for Sub-Seven-Nanometer Bottom-Up Metal Interconnects

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