Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment

Quintero, Pedro O.; McCluskey, F. Patrick

doi:10.4071/1551-4897-6.1.66

Cited by 20 publications

(4 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The resulting IMCs melt at temperatures significantly higher than the operating temperatures seen in power modules. Because of this advantage, various TLP materials have been investigated for power module applications including nickeltin [20], gold-indium [23], silver-indium [24], silver-tin [25], and copper-tin [22]. However, double-sided TLP bonding has not yet been reported, especially for front-side bonding of power devices [11].…”

Section: Die-attachment Bonding Technologies For High Temperature Pow...mentioning

confidence: 99%

Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

Yoon¹,

Glover

Mantooth

et al. 2012

J. Micromech. Microeng.

View full text Add to dashboard Cite

This paper presents the feasibility of highly reliable and repeatable copper–tin transient liquid phase (Cu–Sn TLP) bonding as applied to die attachment in high temperature operational power modules. Electrified vehicles are attracting particular interest as eco-friendly vehicles, but their power modules are challenged because of increasing power densities which lead to high temperatures. Such high temperature operation addresses the importance of advanced bonding technology that is highly reliable (for high temperature operation) and repeatable (for fabrication of advanced structures). Cu–Sn TLP bonding is employed herein because of its high remelting temperature and desirable thermal and electrical conductivities. The bonding starts with a stack of Cu–Sn–Cu metal layers that eventually transforms to Cu–Sn alloys. As the alloys have melting temperatures (Cu3Sn: > 600 °C, Cu6Sn5: > 400 °C) significantly higher than the process temperature, the process can be repeated without damaging previously bonded layers. A Cu–Sn TLP bonding process was developed using thin Sn metal sheets inserted between copper layers on silicon die and direct bonded copper substrates, emulating the process used to construct automotive power modules. Bond quality is characterized using (1) proof-of-concept fabrication, (2) material identification using scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis, and (3) optical analysis using optical microscopy and scanning acoustic microscope. The feasibility of multiple-sided Cu–Sn TLP bonding is demonstrated by the absence of bondline damage in multiple test samples fabricated with double- or four-sided bonding using the TLP bonding process.

show abstract

Section: Die-attachment Bonding Technologies For High Temperature Pow...mentioning

confidence: 99%

Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

Yoon¹,

Glover

Mantooth

et al. 2012

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…It has been shown that solder pastes can be filled with Cu particles to achieve TLPS bonds [20]. AgIn pastes have also been used to form joints at low temperatures [21]. The joint strength at high temperatures has not yet been assessed in the literature.…”

Section: Introductionmentioning

confidence: 99%

LT-TLPS Die Attach for High Temperature Electronic Packaging

Greve¹,

McCluskey²

2014

Journal of Microelectronics and Electronic Packaging

View full text Add to dashboard Cite

Low temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, process analyses and shear strength studies of paste-based approaches to LT-TLPS are presented. The process progression studies include DSC analyses and observations of intermetallic compound (IMC) formation by cross-sectioning. It was found that the sintering process reaches completion after sintering times of 15 min for process temperatures approximately 50°C above the melting point of the low temperature constituent. For the shear studies, test samples consisting of copper dice and copper substrates joined by sintering with a variety of sinter pastes with different ratios of copper and tin have been assessed. A fixture was designed for high temperature enabled shear tests at 25°C, 125°C, 250°C, 400°C, and 600°C. The influence of the ratio of the amount of high melting-point constituent to the amount of low melting-point constituent on the maximum application temperature of the sinter paste was analyzed. Ag20Sn and Cu50Sn pastes showed no reduction in shear strength up to 400°C, and Cu40Sn pastes showed high shear strengths up to 600°C. It was shown that LT-TLPS can be used to form high temperature stable joints at low temperatures without the need to apply pressure during processing.

show abstract

“…Ag migration under bias at high temperature is also a reliability concern [9]. Transient liquid phase bonding (TLP) [10] has shown potential for die attach for temperatures up to 500°C [11], [12]. Many of the TLP systems are based on Au or Ag and are expensive and time consuming to process.…”

Section: Introductionmentioning

confidence: 99%

SiC Power Device Die Attach for Extreme Environments

Shen

Johnson

Hamilton

2015

IEEE Trans. Electron Devices

View full text Add to dashboard Cite

Silicon carbide power diodes and transistors are enabling technology for power electronics capable of operating in extreme environments. In this paper, a AgBiX solder paste has been studied for SiC power device die attach to power substrates for 200°C use in vehicle and downhole well logging applications. The solder paste has a controlled amount of Sn, which limits the amount of Sn intermetallic formation. This produces a stable solder joint as a function of time at high temperature. The die shear strength remained at ∼38 MPa through 2000 h of storage at 200°C. After 1000 thermal cycles from −55°C to 195°C, the percent die attach area reduction due to solder cracking was <10%.Index Terms-Die attach, extreme environments, power packaging.

show abstract

Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment

Cited by 20 publications

References 17 publications

Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

LT-TLPS Die Attach for High Temperature Electronic Packaging

SiC Power Device Die Attach for Extreme Environments

Contact Info

Product

Resources

About