2021 International Conference on Electronics Packaging (ICEP) 2021
DOI: 10.23919/icep51988.2021.9451948
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Silicon-Photonics-Embedded Interposers and Their Applications

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Cited by 4 publications
(2 citation statements)
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“…8 SiPH increases functionality by integrating separately manufactured photonic components in silicon (Si)-photonics embedded interposer compatible with the complementary metal-oxide-semiconductor (CMOS) process. [9][10][11] SiPH embedded interposer is a novel co-packaged optics platform 12 that enables the integration of Electronic IC (EIC) and Photonic Integrated Circuits (PIC) [13][14][15] on a commercial silicon-on-insulator (SOI) platform.…”
Section: Introductionmentioning
confidence: 99%
“…8 SiPH increases functionality by integrating separately manufactured photonic components in silicon (Si)-photonics embedded interposer compatible with the complementary metal-oxide-semiconductor (CMOS) process. [9][10][11] SiPH embedded interposer is a novel co-packaged optics platform 12 that enables the integration of Electronic IC (EIC) and Photonic Integrated Circuits (PIC) [13][14][15] on a commercial silicon-on-insulator (SOI) platform.…”
Section: Introductionmentioning
confidence: 99%
“…Published on behalf of The Japan Society of Applied Physics by IOP Publishing Ltd Supplementary material for this article is available online I n the 2010s, silicon-photonics-(Si-Ph) transceivers-(TRXs) have become common components in data centers and are about to become dominant in various applications in systems. 1,2) Demand for wider bandwidths is uninterruptedly urging Si-Ph chips to handle larger optical power. Co-packaging, higher-bandwidth TRXs, and highpower digital-coherent light sources are at the forefront of ongoing and upcoming applications.…”
mentioning
confidence: 99%