Silicon oxynitride films
false(SilOmNpfalse)
have been deposited from
SiH4‐CO2‐NH3‐H2
chemical system in a vertical, cold‐wall, multiple wafer, barrel‐type reactor. The kinetics of
SiH4‐CO2
and
SiH4‐NH3
reactions, both in
H2
, have also been studied in the same reactor. All three reactions are first order with respect to
SiH4
under conditions of “isolation technique.” Within the selected experimental range, the
SiO2
deposition rate is independent of
CO2
concentration, the
Si3N4
deposition rate is independent of
NH3
concentration, and the
SilOmNp
deposition rate is nearly independent of both
CO2
and
NH3
concentrations. The deposition rate of
SiO2
,
Si3N4
, and
SilOmNp
are not dependent on the
H2
flow rate in the experimental range of 60–130 liters/min; thus all three reactions are chemical‐surface rate limited within the experimental range. The activation energies are 23.5, 24, and 29 kcal/g‐mole for
SilOmNp
,
SiO2
, and
Si3N4
, respectively. An anomalous effect of deposition temperature on silicon oxynitride refractive index (composition) was discovered and has been explained by the use of adsorption theory.