2017
DOI: 10.3390/s17092088
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Silicon Nitride Photonic Integration Platforms for Visible, Near-Infrared and Mid-Infrared Applications

Abstract: Silicon nitride photonics is on the rise owing to the broadband nature of the material, allowing applications of biophotonics, tele/datacom, optical signal processing and sensing, from visible, through near to mid-infrared wavelengths. In this paper, a review of the state of the art of silicon nitride strip waveguide platforms is provided, alongside the experimental results on the development of a versatile 300 nm guiding film height silicon nitride platform.

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Cited by 216 publications
(140 citation statements)
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“…Driven by these applications, several materials have been investigated as candidates for visible photonics platform, including SiO 2 [22,23], Si 3 N 4 [24][25][26][27], diamond [28][29][30][31][32], TiO 2 [33] and AlN [34]. With exception of AlN, all of these platforms are electro-optically passive and do not allow for fast control of optical signals.…”
Section: Introductionmentioning
confidence: 99%
“…Driven by these applications, several materials have been investigated as candidates for visible photonics platform, including SiO 2 [22,23], Si 3 N 4 [24][25][26][27], diamond [28][29][30][31][32], TiO 2 [33] and AlN [34]. With exception of AlN, all of these platforms are electro-optically passive and do not allow for fast control of optical signals.…”
Section: Introductionmentioning
confidence: 99%
“…The IMB-CNM is a moderate confinement SiN photonics integration platform aiming at covering a wavelength range from 400-3700 nm for photonic integrated applications such as biophotonics, tele/datacom and sensing (TRL≥7) [76]. The photonic platform runs in the Integrated Micro-and Nanotechnology clean room hosted by the IMB-CNM (CSIC) parallel to a standard CMOS line.…”
Section: E Imb-cnm Sin Platformmentioning
confidence: 99%
“…Interestingly, the process recipes for silicon nitride are favorable for large-scale photonic networks; when deposited by LPCVD Si3N4 is characterized by both high material stability and refractive index regularity, as well as nanoscale etch-resolution and lower surface roughness, which leads to reduced scattering and hence low optical losses per unit length (<10 dB/m) for a 0.5 mm bending radii, which is 10-100x lower compared to SOI. 40 In contrast to SOI, due to the fundamental flexibility of the deposition techniques 41 , Si3N4 also allows for easy integration and 3D stacking flexibility with either SOI or CMOS platforms 42 . Regarding other material integration into this silicon nitride platform, several options have been successfully embedded such as a number of metals or colloidal quantum dots.…”
Section: Passive Photonic Neural Network Interconnectivity: Waveguidementioning
confidence: 99%