2004
DOI: 10.1021/nl0350175
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Silicon Nitride Nanosieve Membrane

Abstract: An array of very uniform cylindrical nanopores with a pore diameter as small as 25 nm has been fabricated in an ultrathin micromachined silicon nitride membrane using focused ion beam (FIB) etching. The pore size of this nanosieve membrane was further reduced to below 10 nm by coating it with another silicon nitride layer. This nanosieve membrane possesses adequate mechanical strength up to several bars of transmembrane pressure, and it can withstand high temperatures up to 900 °C. In addition, it is inert to … Show more

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Cited by 259 publications
(207 citation statements)
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“…DNA passage could be detected and discrimination between DNA fragments of differing lengths was possible. Tong et al 59 prepared arrays of nanopores in silicon nitride, with a pore width below 10 nm achieved. Such devices could be utilised for size-exclusion separation processes.…”
Section: Nanoporesmentioning
confidence: 99%
“…DNA passage could be detected and discrimination between DNA fragments of differing lengths was possible. Tong et al 59 prepared arrays of nanopores in silicon nitride, with a pore width below 10 nm achieved. Such devices could be utilised for size-exclusion separation processes.…”
Section: Nanoporesmentioning
confidence: 99%
“…[22] This open morphology of a nanowire ensemble compared to nanometer-sized pores in inverted networks will be superior for applications dealing with large molecules and liquids, for example in microfluidic environments. [23] Integration of III-V nanowires with silicon [20] will lead to hybrid nanowire metamaterials that will benefit from existing functionalization methods [22] while maintaining the electrical and optical properties of the III-V backbone. High-density nanowire metamaterials will also be of importance for nextgeneration photovoltaic designs.…”
Section: Introductionmentioning
confidence: 99%
“…This method does not allow control over the number of pores. Pores can also be fabricated one by one using ion beam sculpting (27), focused ion beam drilling (28), e-beam lithography (29), or e-beam drilling in a transmission electron microscope (TEM) (30). Although these serial approaches can be applied to various silicon and even polymer materials, they are suitable only for preparation of membranes with low numbers of pores.…”
mentioning
confidence: 99%