Silicon Nitride Ceramics

Petzow, G.; Herrmann, Matthias

doi:10.1007/3-540-45623-6_2

Cited by 202 publications

(161 citation statements)

References 386 publications

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“…Electrical resistivity of Si 3 N 4 is bigger than 10 12 X m at room temperature. 26 SiO 2 is also not a conductor. Therefore, the addition of the two fillers in epoxy resin will increase the electrical resistivity of EMC.…”

Section: Electrical Propertiesmentioning

confidence: 96%

High thermal conductive epoxy molding compound with thermal conductive pathway

Zeng

Shen

et al. 2009

J of Applied Polymer Sci

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The epoxy molding compound (EMC) with thermal conductive pathways was developed by structure designing. Three kinds of EMCs with different thermal conductivities were used in this investigation, specifically epoxy filled with Si 3 N 4 , filled with hybrid Si 3 N 4 /SiO 2 , and filled with SiO 2 . Improved thermal conductivity was achieved by constructing thermal conductive pathways using high thermal conductivity EMC (Si 3 N 4 ) in low thermal conductivity EMC (SiO 2 ). The morphology and microstructure of the top of EMC indicate that continuous network is formed by the filler which anticipates heat conductivity. The highest thermal conductivity of the EMC was 2.5 W/m K, reached when the volume fraction of EMC (Si 3 N 4 ) is 80% (to compare with hybrid Si 3 N 4 /SiO 2 filled-EMC, the content of total fillers in the EMC was kept at 60 vol %). For a given volume fraction of EMC (Si 3 N 4 ) in the EMC system, thermal conductivity values increase according to the order EMC (Si 3 N 4 ) particles filled-EMC, hybrid Si 3 N 4 /SiO 2 filled-EMC, and EMC(SiO 2 ) particles filled-EMC. The coefficient of thermal expansion (CTE) decreases with increasing Si 3 N 4 content in the whole filler. The values of CTE ranged between 23 Â 10 À6 and 30 Â 10 À6 K À1. The investigated EMC samples have a flexural strength of about 36-39 MPa. The dielectric constant increases with Si 3 N 4 content but generally remains at a low level (<6, at 1 MHz). The average electrical volume resistivity of the EMC samples are higher than 1.4 Â 10 10 X m, the average electrical surface resistivity of the EMC samples are higher than 6.7 Â 10 14 X.

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Section: Electrical Propertiesmentioning

confidence: 96%

High thermal conductive epoxy molding compound with thermal conductive pathway

Zeng

Shen

et al. 2009

J of Applied Polymer Sci

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“…12), 13) The liquid phase formation due to the eutectic reaction between the additives and Si 3 N 4 works as a vehicle for the material transportation to synthesize SiAlON phosphors. Theoretically, the liquid phase for the synthesis of SiAlONs is transient so that the final product is free from the amorphous phase due to complete crystallization.…”

Section: )7)11)mentioning

confidence: 99%

The effect of flux addition to Eu<sup>2+</sup>-doped Ca-α-SiAlON phosphor

Park

Kim

et al. 2013

J. Ceram. Soc. Japan

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A yellow-emitting Eu 2+ -doped Ca-¡-SiAlON phosphor is a promising candidate to make white LEDs by combining with blue LED. In the current research, the effect of flux (NH 4 Cl or NH 4 F) addition on the Ca-¡-SiAlON:Eu 2+ phosphor was investigated. The formation of both the compound and liquid phase between the flux and raw materials resulted in the decreased photoluminescence (PL) intensity in the early stage. However, the subsequent melting of second phases and retarded crystallization enhanced the PL intensity with increasing the synthesis temperature and time. The increased PL intensity for the flux-added compositions is attributed to the less surface damages due to grinding of as-synthesized agglomerate-like phosphors. Further, the flux addition enhanced the particle growth by forming agglomerates in the early stage and it also influenced the particle morphology from the typical acicular shape to pseudo-equiaxed shape.

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“…Synthesized in 1859, it was first manufactured into useful refractory shapes in the 1950s-60s, but was not extensively developed as an engineered ceramic until the 1980s [1][2][3][4]. Since then, it has garnered considerable attention because of its unique combination of excellent room-and high-temperature mechanical strength, toughness, oxidation, and thermal shock resistance [1,[5][6][7][8][9][10][11][12][13][14][15]. Si 3 N 4 is currently used in demanding mechanical applications involving high loads, wear, and corrosion [16].…”

Section: Introductionmentioning

confidence: 99%