High thermal conductive epoxy molding compound with thermal conductive pathway

Abstract

The epoxy molding compound (EMC) with thermal conductive pathways was developed by structure designing. Three kinds of EMCs with different thermal conductivities were used in this investigation, specifically epoxy filled with Si 3 N 4 , filled with hybrid Si 3 N 4 /SiO 2 , and filled with SiO 2 . Improved thermal conductivity was achieved by constructing thermal conductive pathways using high thermal conductivity EMC (Si 3 N 4 ) in low thermal conductivity EMC (SiO 2 ). The morphology and microstructure of the top of EMC indicate that continuous network is formed by the filler which anticipates heat conductivity. The highest thermal conductivity of the EMC was 2.5 W/m K, reached when the volume fraction of EMC (Si 3 N 4 ) is 80% (to compare with hybrid Si 3 N 4 /SiO 2 filled-EMC, the content of total fillers in the EMC was kept at 60 vol %). For a given volume fraction of EMC (Si 3 N 4 ) in the EMC system, thermal conductivity values increase according to the order EMC (Si 3 N 4 ) particles filled-EMC, hybrid Si 3 N 4 /SiO 2 filled-EMC, and EMC(SiO 2 ) particles filled-EMC. The coefficient of thermal expansion (CTE) decreases with increasing Si 3 N 4 content in the whole filler. The values of CTE ranged between 23 Â 10 À6 and 30 Â 10 À6 K À1. The investigated EMC samples have a flexural strength of about 36-39 MPa. The dielectric constant increases with Si 3 N 4 content but generally remains at a low level (<6, at 1 MHz). The average electrical volume resistivity of the EMC samples are higher than 1.4 Â 10 10 X m, the average electrical surface resistivity of the EMC samples are higher than 6.7 Â 10 14 X.

Effect of backbone moiety in epoxies on thermal conductivity of epoxy/alumina composite

“…Numerous reports mention to this in the literatures. The composites that are made by mixing the thermosetting polymers with high thermal conductive inorganic powders such as Al 2 O 3 [3–10], aluminum nitride (AlN) [11–14], boron nitride (BN) [15, 16], silicon nitride (Si 3 N 4 ) [17, 18], even carbon nanotube (CNT) [19, 20] and diamond [21] are a few proofs.…”

Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

“…By adding thermal conductive fillers to polymers, the thermal behavior and dielectric properties of packaging materials can be improved remarkably. The literatures concerning thermal conductive polymer composites are particularly focused on the use of different kinds of ceramics, such as boron nitride (BN) , aluminum nitride (AlN) , silica (SiO 2 ) , silicon nitride (Si 3 N 4 ) , alumina (Al 2 O 3 ) , silicon carbide (SiC) , and clays . Different nanoparticles have been used to improve the thermal conductivity of polymers.…”

Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material

“…Extensive research has been carried out to enhance the thermal conductivity of the polymers by adding thermally conductive fillers. These fillers can be metallic powders,3 carbon‐based fillers,4–7 or ceramic powders 8–20. The polymers filled with metallic particles or carbon materials can exhibit a thermal conductivity of more than 10 W/(m K), but they are not suitable for applications requiring electrical insulation.…”