We report for a novel packaging and experimental technique to characterize thermal flow sensors at high temperatures. To start with, the paper briefly presents the fabrication of 3C-SiC (silicon carbide) on a glass substrate via anodic bonding, followed by the study of thermoresistive and Joule heating effects in the 3C-SiC nano-thin film heater. A high thermal coefficient of resistance (TCR) of approximately-20,720 ppm/K at ambient temperature and-9,287 ppm/K at 200°C suggest the potential use of silicon carbide for thermal sensing applications in harsh environments. During the Joule heating test, a high temperature epoxy and a brass metal sheet were utilized to establish the electric conduction between the metal electrodes and the SiC heater inside a temperature oven. In addition, the metal wires from the sensor to external circuitry were protected by a fibre glass insulating sheath to avoid short-circuit. The Joule heating test ensured the mechanical and Ohmic contact stabilities at elevated temperatures. Using a hot-wire anemometer as reference flow sensor, calibration test was performed at 25°C, 35°C and 45°C in the oven. Finally, the SiC hot-film sensor was characterized for a range of low air flow velocity, indicating a sensitivity of 5 mm-1 s. The air flow was established by driving a metal propeller connected to a DC motor and controlled by a microcontroller. The materials, metallization and interconnects used in our flow sensor were robust and survived temperatures of around 200°C.