Silicon fusion bonding for pressure sensors

Petersen, K.; Barth, Philip W.; Poydock, J.; Brown, Joe; Mallon, Joseph R.; Bryzek, Janusz

doi:10.1109/solsen.1988.26462

Cited by 92 publications

(22 citation statements)

References 6 publications

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“…The first use of hydrophilic wafer bonding in a MEMS application can be found in the 1988 paper by Peterson and Berth, 8 describing the creation of pressure sensors.…”

Section: History and Establishment Of The Artmentioning

confidence: 99%

A Review of Hydrophilic Silicon Wafer Bonding

Masteika

Kowal

Braithwaite

et al. 2014

ECS J. Solid State Sci. Technol.

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Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer. © 2014 The Electrochemical Society. [DOI: 10.1149/2.007403jss] All rights reserved.Manuscript submitted June 5, 2013; revised manuscript received December 9, 2013. Published February 3, 2014 This review covers the key papers relating to the theory, techniques and quantification of hydrophilically activated silicon wafer bonding. This begins with a review of the history and development of the art. Bond strength characterization is then reviewed followed first by models of physical deformation and then by plasma and radical activation techniques.In the interests of clarity and succinctness this review is not an attempt to exhaustively catalog all direct bonding wafer literature. Excluded are hydrophobic and UHV bonding, and the many papers applying bonding techniques to differing combinations of wafer materials. This paper concludes with a summery of the state of the art of direct wafer bonding and a summation of the current wafer-bonding model derived from the papers reviewed. History and Establishment of the Art

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“…The first use of hydrophilic wafer bonding in a MEMS application can be found in the 1988 paper by Peterson and Berth, 8 describing the creation of pressure sensors.…”

Section: History and Establishment Of The Artmentioning

confidence: 99%

A Review of Hydrophilic Silicon Wafer Bonding

Masteika

Kowal

Braithwaite

et al. 2014

ECS J. Solid State Sci. Technol.

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show abstract

“…2 [10]. Here, the pressure sensor is formed by a high-temperature silicon direct bond, followed by thinning of a wafer and fabrication of the piezoresistors.…”

Section: The Role Of Bonding In Microstructure Formationmentioning

confidence: 99%

Wafer-to-wafer bonding for microstructure formation

1998

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“…Silicon piezo-resistive and capacitive based pressure sensors have been reported and developed [18][19][20]. However, silicon based pressure sensors have suffered serious mechanical performance degradations when used in harsh environment.…”

Section: Introductionmentioning

confidence: 99%