1996
DOI: 10.1109/16.536819
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Silicon carbide high-power devices

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Cited by 405 publications
(166 citation statements)
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“…Silicon carbide (SiC) is the most suitable semiconductor material for fabricating devices that are used in highpower, high-frequency and chemically corrosive environments [1]. Ion-implantation is the only practical selective area doping technique available for making these devices [2,3], since diffusion coefficients of the technologically relevant dopants in SiC are very low even at temperatures as high as 1800°C.…”
Section: Introductionmentioning
confidence: 99%
“…Silicon carbide (SiC) is the most suitable semiconductor material for fabricating devices that are used in highpower, high-frequency and chemically corrosive environments [1]. Ion-implantation is the only practical selective area doping technique available for making these devices [2,3], since diffusion coefficients of the technologically relevant dopants in SiC are very low even at temperatures as high as 1800°C.…”
Section: Introductionmentioning
confidence: 99%
“…Additional attractive features of SiC, which are presently utilized in rf devices operating in hostile and high-temperature (> 1000 C) environments [20], are its robustness to heat loading and its high electrical breakdown (DC threshold $300 MV=m). High-quality SiC films can be grown on silicon [21] and other substrates [22] that are subsequently machined into a prismlike shape for coupling infrared radiation into and out of the structure, as shown in Fig.…”
Section: Materials Properties Of Silicon Carbidementioning
confidence: 99%
“…1,2 The hot wall, horizontal chemical vapor deposition (CVD) method is the most studied and best suited technique for growing the epitaxial layers which serve as the active region in all electronic SiC devices. 3 The demands on the layers differ substantially between different applications, e.g.…”
Section: Introductionmentioning
confidence: 99%