The ATHENIS_3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuitlevel (inductorless high-voltage DC DC converter, hightemperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS_3D allows for one order of magnitude area reduction vs. today PCBbased power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defence, industrial automation, energy).