1992
DOI: 10.1016/0924-4247(92)85002-j
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Silicon cantilevers and tips for scanning force microscopy

Abstract: Monocrystallme slhcon canttlevers with Integrated sdlcon tips for scannmg force mlcroscopy are fabncated by means of mlcromachmmg techmques Theorettcal conslderatlons mcludmg fimte element modelhng have been carried out m order to find a smtable shape and dlmenslons according to the mechanical requirements Several different cantilever designs have been fabricated a simple beam with various cross se&Ions as well as a folded meander shape with square cross section Special attention has been paid to the apphcatlo… Show more

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Cited by 71 publications
(31 citation statements)
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“…The corresponding errors are indicated in the graph, giving the corresponding best fit. From the slope of the curve, E w is determined using equation (2). The bulk value of ρ w = 19.3 × 10 3 kg m −3 [23] is used and t = 500 nm, giving E w = 380 GPa.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The corresponding errors are indicated in the graph, giving the corresponding best fit. From the slope of the curve, E w is determined using equation (2). The bulk value of ρ w = 19.3 × 10 3 kg m −3 [23] is used and t = 500 nm, giving E w = 380 GPa.…”
Section: Resultsmentioning
confidence: 99%
“…Since the invention of the AFM in 1986 [1], only a very few alternatives to silicon (Si) [2][3][4] or silicon nitride (SiN) [5,6] AFM-cantilevers/tips have been introduced. Some alternatives include (boron (B)-doped) diamond like carbon (DLC) [7][8][9], nickel (Ni) [10,11], GaAs [12] and SU-8 [13].…”
Section: Introductionmentioning
confidence: 99%
“…2͑c͔͒ and the photoresist is stripped in acetone. The cantilevers with integrated tips are defined by successive RIE and BHF etchings as previously reported for simple cantilevers 9 ͓see Fig. 2͑d͔͒.…”
Section: Structure Design and Fabricationmentioning
confidence: 99%
“…In the steady state the displacement z from the static equilibrium position is given by the standard resonance equation [15] . ( 1 (16) with the quality factor Q = m,Rw,,/c.…”
Section: Dynamic Dej7ectionmentioning
confidence: 99%
“…The structure is completely fabricated by means of silicon micromachining techniques as illustrated in Fig 5. The process is based on the fabrication of monocrystalline silicon SFM cantilevers with tips [16] and extended by additional steps including silicon fusion bonding (SFB) and reactive ion etching (RIE). After thermal oxidation to 1.5 pm SiO, of two 280 pm thick phosphorus-doped silicon wafers (p=O.O3 fl cm), both wafers are patterned by photolithography and SiO, etching in buffered hydrofluoric acid (BIG); the upper wafer with the cantilever shape (see dashed line in Fig.…”
Section: Device Fabricationmentioning
confidence: 99%