2000
DOI: 10.1007/bf02344773
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Silicon-based microelectrodes for neurophysiology, micromachined from silicon-on-insulator wafers

Abstract: A process is described for the fabrication of silicon-based microelectrodes for neurophysiology using bonded and etched-back silicon-on-insulator (BESOI) wafers. The probe shapes are defined without high levels of boron doping in the silicon; this is considered as a step towards producing probes with active electronics integrated directly beneath the electrodes. Gold electrodes, of 4 microns by 4 microns to 50 microns by 50 microns are fabricated on shanks (cantilever beams) 6 microns thick and which taper to … Show more

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Cited by 23 publications
(12 citation statements)
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“…Silicon-based multichannel electrode arrays (Campbell et al 1991;Drake et al 1988;Ensell et al 2000;Kewley et al 1997;Kovacs et al 1994;Norlin et al 2002;Spence et al 2003;Wise and Najafi 1991;Yoon et al 2000), or polytrodes, afford electrophysiological recording capabilities beyond those of conventional single-unit or multiple wire electrodes. As with stereotrodes (McNaughton et al 1983) and tetrodes (Wilson and McNaughton 1993), polytrodes are designed to make extracellular multiunit recordings from adjacent active neurons.…”
Section: Introductionmentioning
confidence: 98%
“…Silicon-based multichannel electrode arrays (Campbell et al 1991;Drake et al 1988;Ensell et al 2000;Kewley et al 1997;Kovacs et al 1994;Norlin et al 2002;Spence et al 2003;Wise and Najafi 1991;Yoon et al 2000), or polytrodes, afford electrophysiological recording capabilities beyond those of conventional single-unit or multiple wire electrodes. As with stereotrodes (McNaughton et al 1983) and tetrodes (Wilson and McNaughton 1993), polytrodes are designed to make extracellular multiunit recordings from adjacent active neurons.…”
Section: Introductionmentioning
confidence: 98%
“…For the latter, different approaches are applied to structure the microprobes. These include boron-doping used as wet etch-stop (Wise et al, 1970;Najafi et al, 1985;Takahashi and Matsuo, 1984;Leong et al, 1990), combined dry and wet etching of silicon (Kewley et al, 1997;Yoon et al, 2000), or only dry etching procedures (Errachid et al, 2001;Wassum et al, 2008;Herwik et al, 2009) including also the use of SOI substrates (Ensell et al, 2000;Norlin et al, 2002;Cheung et al, 2003). Each probe is patterned with multiple thin-film electrodes along the length of the shaft adapted to specific experimental requirements and allows parallel recordings from several sites on a single, implanted microprobe.…”
Section: Introductionmentioning
confidence: 98%
“…In addition, an insulating layer between the metal and the silicon substrate may be necessary to reduce electrical cross-talk between adjacent recording sites because silicon is a semiconductor [121], [133]- [137]. The semiconductor properties of silicon can be altered by doping [124], [125], [137]. Silicon is very compatible with on-board circuitry.…”
Section: B Silicon-based Microelectrodesmentioning
confidence: 99%