SiGe BiCMOS and eWLB packaging technologies for automotive radar solutions

Böck, J.; Lachner, Rudolf

doi:10.1109/icmim.2015.7117932

Cited by 13 publications

(2 citation statements)

References 9 publications

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“…14. As discussed in Section IV-A, Wojnowski and Bock from Infineon, for the first time, reported the fan-out wafer-level packaging (FOWLP) technology with their eWLB and presented antenna-integrated package in 2012 and 2015 [97], [98]. Advanced Semiconductor Engineering (ASE) reported, in 2019, the FOWLP processes for stacked-patch antennas to enhance the bandwidth [99].…”

Section: Antenna Systems In Package (Aip)mentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

142

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Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

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Section: Antenna Systems In Package (Aip)mentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

142

View full text Add to dashboard Cite

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“…† †The author is with Hitachi Astemo, Ltd., Sensing System Design Dept., AD/ADAS Business Unit, Hitachinaka, Ibaraki, Japan. (1) performance of MMICs also improves SNR [11][12][13][14][15], but in any case, LRRs require highly efficient antennas. Additionally, to reduce the coupling, the antennas and the MSLs of each channel need to be physically separated from adjacent channels.…”

Section: Introductionmentioning

confidence: 99%

High-Density Implementation Techniques for Long-Range Radar Using Horn and Lens Antennas

Kitayama

Kuriyama

Nagaishi

et al. 2021

IEICE Trans. Electron.

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Long-range radars (LRRs) for higher level autonomous driving (AD) will require more antennas than simple driving assistance. The point at issue here is 50-60 % of the LRR module area is used for antennas. To miniaturize LRR modules, we use horn and lens antenna with highly efficient gain. In this paper, we propose two high-density implementation techniques for radio-frequency (RF) front-end using horn and lens antennas. In the first technique, the gap between antennas was eliminated by taking advantage of the high isolation performance of horn and lens antennas. In the second technique, the RF front-end including micro-strip-lines, monolithic microwave integrated circuits, and peripheral parts is placed in the valley area of each horn. We fabricated a prototype LRR operating at 77 GHz with only one printed circuit board (PCB). To detect vehicles horizontally and vertically, this LRR has a minimum antenna configuration of one Tx antenna and four Rx antennas placed in 2×2 array, and 30 mm thickness. Evaluation results revealed that vehicles could be detected up to 320 m away and that the horizontal and vertical angle error was less than +/-0.2 degrees, which is equivalent to the vehicle width over 280 m. Thus, horn and lens antennas implemented using the proposed techniques are very suitable for higher level AD LRRs.

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