2006
DOI: 10.1016/j.tsf.2005.08.402
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Si1−Ge sputter epitaxy technique and its application to RTD

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Cited by 18 publications
(18 citation statements)
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“…Recently, we have proposed a SiGe sputter epitaxy method for Si 1-x Ge x layer growth and we have obtained high crystalline layers [5]. Furthermore, we have reported on the method of formation of a flat Ge layer on a heavy boron-or phosphorous-doped Si(001) substrate with our proposed sputter epitaxy method [6,7].…”
Section: Introductionmentioning
confidence: 97%
“…Recently, we have proposed a SiGe sputter epitaxy method for Si 1-x Ge x layer growth and we have obtained high crystalline layers [5]. Furthermore, we have reported on the method of formation of a flat Ge layer on a heavy boron-or phosphorous-doped Si(001) substrate with our proposed sputter epitaxy method [6,7].…”
Section: Introductionmentioning
confidence: 97%
“…Various SiGe thin film growth technologies have been developed, such as ultra-high vacuum chemical vapor deposition (UHVCVD), plasma-enhanced CVD (PECVD), magnetic RF sputtering system, and molecular beam epitaxy (MBE) [1][2][3][4][5][6][7][8], etc. Recently, high performance microcrystalline SiGe films were grown at low temperature by our designed LAPECVD system using SiH 4 and GeH 4 as the precursor gases [9][10].…”
Section: Introductionmentioning
confidence: 99%
“…We have recently developed a Si/Ge sputter epitaxy method for state-of-the-art Si/Si 1-x Ge x devices [1]. The Si/Si 1-x Ge x layers are currently fabricated by MBE (molecular beam epitaxy) and CVD (chemical vapor deposition).…”
Section: Introductionmentioning
confidence: 99%
“…To overcome this difficulty, we have recently developed a UHV-compatible magnetron sputter epitaxy method with a combination of Ar/H 2 mixture working gas [1]. With this method, we have obtained high quality Si 1-x Ge x epitaxial layers.…”
Section: Introductionmentioning
confidence: 99%