“…One is to decrease size by controlling silicon morphology, including nanomaterials, nanospheres, nanowires, , nanofilms, nanotubes, mesoporous silicon, , and three-dimensional (3D) structures, − which reduce structural collapse and pulverization by preventing silicon from cracking. Another is to form composites by modifying various materials such as carbon, , graphene, MXene, − metals (Ag, Cu, Ti, and Sn), silicon suboxide, and conductive polymers . However, these only suppress the volume change of silicon without considering the heat effects during cycles, while the generated heat will cause volume change or side reactions to worsen its performance.…”