International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217)
DOI: 10.1109/iedm.1998.746490
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Si field emitter array with 90-nm-diameter gate holes

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Cited by 4 publications
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“…Most recently, processes have been developed, which use oxidation-sharpened tips but remove the mask after the initial etch and form the gates using either traditional planarization techniques [37] (see Fig. 5.2) or CMP [6,38,39]. Using these methods, the gate aperture diameter can be made smaller than the original mask.…”
Section: Oxidation Sharpeningmentioning
confidence: 99%
“…Most recently, processes have been developed, which use oxidation-sharpened tips but remove the mask after the initial etch and form the gates using either traditional planarization techniques [37] (see Fig. 5.2) or CMP [6,38,39]. Using these methods, the gate aperture diameter can be made smaller than the original mask.…”
Section: Oxidation Sharpeningmentioning
confidence: 99%