Shear Strength and Dsc Analysis of High-Temperature Solders

Koleňák, Roman; Martinkovič, Maroš; Koleňáková, Monika

doi:10.2478/amm-2013-0031

Cited by 8 publications

(4 citation statements)

References 16 publications

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“…Another reason is the solid solution hardening effect of Sb. Some studies have found that when Sb is added to SAC alloy, Sb can have a solid solution hardening effect in the β-Sn matrix phase [ 31 , 32 ]. After adding Sb, more Ag 3 (Sn, Sb) and Cu 6 (Sn, Sb) 5 particles precipitated on the Cu 6 Sn 5 layer, and the grain hardening effect occurred [ 7 ].…”

Section: Resultsmentioning

confidence: 99%

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Yan

Gao

et al. 2020

Materials

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To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.

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Section: Resultsmentioning

confidence: 99%

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Yan

Gao

et al. 2020

Materials

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“…These competitive strategies focus primarily on customer groups. However, these strategies may focus on competitor activities and proactive seekers of foreign expansion (Koleňák, Koleňáková, 2012).…”

Section: Theoretical Backgroundmentioning

confidence: 99%

Profit indicators in performance systems in the Czech companies

Hornungová¹,

Milichovský²

2013

Acta Univ. Agric. Silvic. Mendelianae Brun.

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HORNUNGOVÁ JANA, MILICHOVSKÝ FRANTIŠEK: Profi t indicators in performance systems in the Czech companies. Acta Universitatis Agriculturae et Silviculturae Mendelianae Brunensis, 2013, LXI, No. 2, pp. 345-352 The main focus of the paper is the corporate performance measurement. At present, it is necessary to monitor this corporate performance and mostly try to improve it, because it could be very crucial competitive advantage in the market. The article provides an overview of key performance indicators (KPIs) in the companies. Based on the theoretical data there are applied statistical methods, which should be achieved of main aim of the paper. The main aim of the paper is to describe which groups of Key Performance Indicators are connected with corporate performance system of measurement in the area of Information and Communication Activities. To support this approach theoretical information from the area of Key Performance Indicators connected with data from primary research were used, focused on the performance evaluation of enterprises. Successful companies are aware of the need for long-term strategic development, which is based on teamwork, respect of external environment and all subjects, which infl uence the business activities of the company directly or indirectly. It can be more eff ective to conceptualize relationship complete than limit to only consumer market and customer relations. Marketing moves more and more away from individual transaction orientation and rather focus on value creating relations, where the objective is to provide long-term stakeholder value. Day a er day the company gets in touch with diff erent groups of stakeholders, that infl uence the corporate development and it can not to access to these interest groups individually for reason of corporate limits. It is therefore necessary to defi ne homogenous stakeholders groups, which are diff er from each other in terms of their impact on business management. The authors of article put the question, which classifi cation is the most statistical explaining the diff erence of stakeholders in term of evaluation their impact on business management. It was made cluster analysis for data mining including its graphic presentation through dendogram by statistical so ware IBM SPSS Statistics 20 to obtain relevant answer.performance, fi nancial indicators, measurement, KPIs, Czech companies The topic of this paper is the performance measurement, which can help to companies organize daily activities to achieve strategic goals. Kaplan and Norton (1992) describe performance measurement as a way to review an organization's fi nancial and non-fi nancial goals. Indicators, that are used, we can classify as the performance indicators. This is a group of indicators that focus on the most critical areas for current and future development of the company. As we mentioned in the abstract of this paper, the performance is very crucial competitive advantage in the market and it should be in the interest of the enterprises monitor key indicators an...

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“…Reactions on the boundary of Bi-solders and metallic substrates were studied in works [15][16][17][18][19]. Examples of another solders are in the following studies [20][21][22][23][24][25][26][27][28].…”

Section: Introductionmentioning

confidence: 99%

ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

2016

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This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by a fluxless process on the air, by activation with a power ultrasound. It was found out that, during the process of ultrasonic soldering, lanthanum is distributed on the boundary, both with the copper and the ceramic substrate, which enhances the joint formation. The bond with Al2O3 ceramics is of an adhesive character, without the formation of a new contact interlayer.

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Shear Strength and Dsc Analysis of High-Temperature Solders

Cited by 8 publications

References 16 publications

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Profit indicators in performance systems in the Czech companies

ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

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