Shape memory properties and oxidation behaviour of a rapidly liquid quenched Cu–Sn alloy

Ceylan, Mehmet; Zengin, Raşit

doi:10.1016/s0924-0136(99)00381-7

Cited by 6 publications

(3 citation statements)

References 2 publications

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“…Amongst the Cu-based SMAs, the Cu-Sn system has been least investigated, possibly due to the poor shape-memory and superelastic effect of bulk polycrystals [23][24][25][26]. Li et al reported good shape memory effect of rapidly quenched ribbons of Cu-Sn polycrystalline alloys with a grain size of about 1.5 µm.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Superelasticity of Cu-Sn Shape-Memory Microwires by Glass-Coated Melt Spinning

Bai¹,

Li²,

Zhang³

2023

Preprint

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Cu-Sn shape-memory microwires were fabricated by a glass-coated melt spinning method. Effects of Sn content on the microstructure and mechanical property of microwires were investigated. The phase transforms from martensite to austenite with Sn content increasing from 14.0 atomic percent (at.%) to 16.5 at.%, and highly ordered intermetallic phase, δ, formed with higher Sn content. The fracture stress, σf, and the critical stress for martensitic transformation, σMs, increases with Sn content increasing. The mechanical property as well as superelasticity were improved greatly by high cooling rate of the glass-coated melt spinning method.

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Section: Introductionmentioning

confidence: 99%

Microstructure and Superelasticity of Cu-Sn Shape-Memory Microwires by Glass-Coated Melt Spinning

Bai¹,

Li²,

Zhang³

2023

Preprint

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show abstract

“…Amongst the Cu-based SMAs, the Cu-Sn system has been least investigated, possibly due to the poor shape-memory and superelastic effect of bulk polycrystals [23][24][25][26]. Li et al [25] reported a good shape memory effect of rapidly quenched ribbons of Cu-Sn polycrystalline alloys with a grain size of about 1.5 µm.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Superelasticity of Cu–Sn Shape-Memory Microwires by Glass-Coated Melt Spinning

Zhao,

Bai,

et al. 2023

Metals

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Cu–Sn shape-memory microw ires were fabricated by a glass-coated melt spinning method. Effects of Sn content on the microstructure and mechanical properties of microwires were investigated. The phase transforms from martensite to austenite with an increase in Sn from 14.0 atomic percent (at.%) to 16.5 at.%. When the Sn content exceeds 16.5 at.%, a highly ordered intermetallic phase, δ, formed. The fracture stress (σf) and the critical stress for martensitic transformation (σMs) increases with an increase in Sn content. The mechanical properties as well as the superelasticity were greatly improved by a high cooling rate in the glass-coated melt spinning method. A bamboo-grained structure was formed in the Cu–Sn microwire with a Sn content of 16 at.% by annealing at 750 °C for 5 h before quenching in water. The results indicate that two opposite strategies of refining the grain size to the micrometer level, or increasing the grain size to a one dimensional size of specimen, e.g., the diameter of the wire, are both effective in improving the superelasticity of the Cu–Sn alloy.

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“…Cu-Sn alloys have been electrodeposited for over 170 years [1] as protective coatings, mainly due to their wear and corrosion resistance [2][3][4]. In the last decades, these alloys have found various new applications, such as shape memory materials [5] or lithium-ion battery anodes [6][7][8], thanks to improvement in deposit morphology, composition and structure [9]. Furthermore, semi-conducting Cu-Sn-S alloys prepared by sulfurisation of electrodeposited Cu-Sn have been recently proposed as absorbers in solar cells [10].…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Bengoa

Pary

Conconi

et al. 2017

Electrochimica Acta

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Deposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing small amounts of benzyl alcohol was investigated. Polarisation experiments (cylic and linear sweep voltammetry) were carried out using a rotating disc electrode to identify the reduction and dissolution processes that take place in the system and to determine the effect of the solution constituents on them. Potentiostatic deposition was performed onto a rotating cylinder electrode and the resulting deposits were charactised using SEM and XRD. The results showed that co-deposition of copper and tin is possible even at potentials less cathodic than tin discharge potential. The latter was attributed to the underpotential deposition of Sn 2+ on a copper substrate. Smooth and compact deposits were obtained at various deposition potentials and Cu 2+ concentrations, with Sn contents between 1.6 -62.4 wt.%. Several stable phases, such as pure copper, a-CuSn, e-Cu 3 Sn and h 0 -Cu 6 Sn 5 phase, were detected at different operating conditions. Finally, it was found that BA increases the amount of tin in the deposit when Cu 2+ concentrations in the solution is kept low, especially at high overpotentials. This additive also inhibits the formation of dendrites and reduces surface roughness.

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Shape memory properties and oxidation behaviour of a rapidly liquid quenched Cu–Sn alloy

Cited by 6 publications

References 2 publications

Microstructure and Superelasticity of Cu-Sn Shape-Memory Microwires by Glass-Coated Melt Spinning

Microstructure and Superelasticity of Cu-Sn Shape-Memory Microwires by Glass-Coated Melt Spinning

Microstructure and Superelasticity of Cu–Sn Shape-Memory Microwires by Glass-Coated Melt Spinning

Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

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