Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Abstract

Deposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing small amounts of benzyl alcohol was investigated. Polarisation experiments (cylic and linear sweep voltammetry) were carried out using a rotating disc electrode to identify the reduction and dissolution processes that take place in the system and to determine the effect of the solution constituents on them. Potentiostatic deposition was performed onto a rotating cylinder electrode and the resulting deposits were charactised using SEM and XRD. The results showed that co-deposition of copper and tin is possible even at potentials less cathodic than tin discharge potential. The latter was attributed to the underpotential deposition of Sn 2+ on a copper substrate. Smooth and compact deposits were obtained at various deposition potentials and Cu 2+ concentrations, with Sn contents between 1.6 -62.4 wt.%. Several stable phases, such as pure copper, a-CuSn, e-Cu 3 Sn and h 0 -Cu 6 Sn 5 phase, were detected at different operating conditions. Finally, it was found that BA increases the amount of tin in the deposit when Cu 2+ concentrations in the solution is kept low, especially at high overpotentials. This additive also inhibits the formation of dendrites and reduces surface roughness.

Facile Deposition of Cu−SnOx Hybrid Nanostructures on Lightly Boron‐Doped Diamond Electrodes for CO2 Reduction

“…Controlled growth of nanostructures on a substrate is limited by the electrochemical synthesis methods . This is due to the fact that electrochemical synthesis of nanostructures is typically carried out by chronoamperometric, anodization, pulsed current, and CV deposition methods . Chronoamperometric and anodization methods have been most studied for the synthesis of alloys, metals and metal oxides nanostructures .…”

“…[30][31][32][33] This is due to the fact that electrochemical synthesis of nanostructures is typically carried out by chronoamperometric, anodization, pulsed current, and CV deposition methods. [30][31][32][33][34] Chronoamperometric and anodization methods have been most studied for the synthesis of alloys, metals and metal oxides nanostructures. [35][36][37][38][39][40] However, size-selected and multi-component electrodeposition by potentiodynamic method has not been reported using the bi/trinary precursors solution.…”

Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

“…Electrochemical synthesis techniques of Sn based alloys from an aqueous solution have outdone all other techniques in the fabrication of fine pitch solder bumps due to its cost-effectiveness in mass production [1]. In a trend over time, several research works on the electrodeposition of lead-free solder materials such as Sn-Bi [1,2], Sn-Ag [3,4] and Sn-Cu [5][6][7] alloys have been conducted so far. Among their alloys, Sn-Zn alloys are attracting attention as a promising lead-free solder because of their cost performance, in having the closest melting point to Sn-Pb alloys in eutectic composition, and their excellent mechanical properties [8][9][10].…”

Comparative Leaching Study on Conichalcite and Chalcopyrite Under Different Leaching Systems

“…In this study, two samples are studied for copper extraction under various leaching systems consisted of different acids and oxidants. Sulfuric acid (H 2 SO 4 ) is a common lixiviant for copper leaching; methanesulfonic acid (CH 3 SO 3 H, MSA) is widely used for rust and scale removers and electrodeposition [10,11]. Recently, more projects are focused on its application in the leaching process [12][13][14].…”