2008
DOI: 10.1007/s00542-008-0681-5
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Sensor-guided micro assembly of active micro systems by using a hot melt based joining technology

Abstract: This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516-Design and Manufacturing of Active Micro Systems-which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch … Show more

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Cited by 6 publications
(3 citation statements)
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“…Less the position uncertainty of 1.4 µm the portion of the joining process and the handling components to the assembly uncertainty is 10.5 µm. Compared to the accuracy of assembly process using the passive heat management (69 µm [10]) a reduction of the uncertainty of 85 % using the active heat management could be reached.…”
Section: Assembly Results and Discussionmentioning
confidence: 99%
“…Less the position uncertainty of 1.4 µm the portion of the joining process and the handling components to the assembly uncertainty is 10.5 µm. Compared to the accuracy of assembly process using the passive heat management (69 µm [10]) a reduction of the uncertainty of 85 % using the active heat management could be reached.…”
Section: Assembly Results and Discussionmentioning
confidence: 99%
“…They are easily accessible and economical as proven in industries such as packaging, furniture, book binding, aerospace applications, etc. HMAs' applications in robotics and automation have expanded in the last ten years, which range from handling small parts at the submillimetre scale, e.g., in an automatic microtool changer [39], a gripper [40], microassembly [41], and passive self-assembly [42], to a general mechanism for automatic mechanical connection and disconnection between macroscopic parts [43].…”
Section: Thermoplastic Adhesive Characterizationmentioning
confidence: 99%
“…TPA was chosen because it offers good plastic and bonding properties which can be easily controlled through temperature [29][30][31] for automation purposes. It has been used in robotics and automation to handle small-sized parts at the submillimetre scale [32][33][34][35] as well as in robotic locomotion [36,37]. The type of TPA used in our study (Pattex Hot Stick Transparent, Henkel, Germany) is based on copolymer ethylene vinyl acetate.…”
Section: Introductionmentioning
confidence: 99%