Additional Information:Question ResponsePlease submit a plain text version of your cover letter here.If you are submitting a revision of your manuscript, please do not overwrite your original cover letter. There is an opportunity for you to provide your responses to the reviewers later; please do not add them here.7th June 2017 Dr. Esther Levy Editor-in-Chief, Advanced Materials Technologies Dear Dr. Levy, Please find the manuscript titled, "Modular Lego-electronics". Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80 % will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. Here we show, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor (CMOS) based ICs into modular Lego-electronics with unique geometry that are physically identifiable to ease manufacturing and enhance throughput. We grove various geometry at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (50 m extra) allows targeted site binding like DNA assembly. Different geometries, angles, heights for different modules provide a unique identity to each of the ICs. The two level geometric combination presented here helps in maintaining the uniqueness of individual module to assemble at exact matching site like a perfect lock-and-key model. The performances of assembled ICs offer uncompromised electrical performance, higher yield and fabrication ease. In future, this method can further be expanded for fluidic assisted self-assembly.As reviewers we suggest the following leading authorities:1.William E.
Abstract:Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80 % will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. We show, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor (CMOS) based ICs into modular Lego-electronics with unique geometry that are physically identifiable to ease manufacturing and enhance throughput. We groove various geometry at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (50 m extra) allows targeted site binding like DNA assembly. Different geometries, angles, heights for different modules provide a unique identity to each of t...