Self-strengthening of electroless-plated copper via dual segregation of extremely dilute (0.1%) manganese oxide inclusions

Chen, Giin-Shan; Tau, Ren-Jie; Chen, Sung-Te; Chen, Yen‐Chin; Cheng, Yi-Lung; Fang, Jau–Shiung

doi:10.1016/j.matlet.2019.126711

Cited by 5 publications

(4 citation statements)

References 18 publications

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“…Akolkar and co-workers 151 describe a similar CuMn system and have determined that the Mn oxidation state prior to annealing is +2, suggesting Mn is deposited as MnO or Mn(OH) 2 . Further work by Chen et al 152 using annealed CuMn nanowire composites having ultralow MnO loadings (i.e., ∼0.1 at. %) confirm segregation of MnO at Cu grain boundaries as a mechanism contributing to their increased strength and effectiveness as diffusion barriers.…”

Section: ■ Elementsmentioning

confidence: 99%

“…We summarize each category here using specific examples to describe the process chemistries. The reader interested in additional examples is referred to the following subsequent sections of this review: Magnesium, Barium, and Strontium section, Vanadium, Niobium, and Tantalum section, Molybdenum and Tungsten section, ,− Manganese and Technetium section, − Rhenium section, ,, Iron section, ,− Ruthenium section, ,− Cobalt section, Rhodium section, Iridium section, Copper section, , Indium section, Germanium section, Tin section, Lead section, − Arsenic section, Bismuth section, , and Lanthanide Elements section. − …”

Section: Nonmetalsmentioning

confidence: 99%

“…In general, Mn alloys ,, and oxides ,,, can be deposited via EL processes, primarily for applications as diffusion barriers to control Cu electromigration in ICs and modified electrodes for catalysis of electrochemical reactions. For example, Šljukić and co-workers have prepared CoMn alloys analogous to CoMo systems previously described ( vide supra ) for electrocatalysis of the HER and oxygen evolution reaction (OER) at low η in alkaline solution.…”

Section: Elementsmentioning

confidence: 99%

“…Akolkar and co-workers describe a similar CuMn system and have determined that the Mn oxidation state prior to annealing is +2, suggesting Mn is deposited as MnO or Mn(OH) 2 . Further work by Chen et al . using annealed CuMn nanowire composites having ultralow MnO loadings ( i.e ., ∼0.1 at.…”

Section: Elementsmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: ■ Elementsmentioning

confidence: 99%