Mechanism of strengthening electroless plated copper films with extremely dilute oxide dispersion alloying: The optimal MnO addition

Chen, Giin-Shan; Tau, Ren-Jie; Fang, Jau–Shiung; Cheng, Yi-Lung; Chen, Yen‐Chin

doi:10.1016/j.apsusc.2020.146816

Cited by 6 publications

(3 citation statements)

References 32 publications

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“…While the method required oxidation of substrates not bearing surface hydroxyl sites to enable SAM chemisorption, the use of amine ligand functional groups ,− eliminated the need for environmentally hazardous Sn species. Direct covalent binding of Pd species by the ligands facilitated deposition of adherent EL metal films without the need for substrate surface roughening, permitting fabrication of sub-100 nm features in EL metal. − More recently, others have improved the ligand-based process by replacing costly Pd species by cheaper first row transition metal ions, such as Co, ,, Cu, − or Ni, ,,− capable of autocatalyzing EL metal deposition upon reduction to zerovalent species. Some examples have been presented in the Cobalt section, Nickel section, and Copper section.…”

Section: Discussionmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: Discussionmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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“…The explanation for this result is that alkaline pH balances the charges on PMETAC polymerized N6 NFs and attracts copper particles. The highest weight gain of copper particles and the lowest resistance was observed at 13 pH [22,23].…”

Section: Optimum Temperature Time Ph and Volume Study For Copper-coat...mentioning

confidence: 96%

“…During the test, speed was set at 5.0 mm/min. The following equations were used to calculate the values of stress-strain curves and Young's modulus [22].…”

Section: Materials Characterizationmentioning

confidence: 99%

Electroless Deposition: A Superficial Route to Synthesis of Highly Conductive Electrospun Nylon 6 Nanofibers

et al. 2022

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In this study, we report the synthesis of conductive Nylon 6 nanofibers (N6 NFs) using the electroless deposition (ELD) method. We fabricated the N6 NFs by electrospinning technique and modified the surface with [2-(methacryloyloxy) ethyl] trimethylammonium chloride (PMETAC). After surface modification of N6 NFs, copper metal was successfully deposited using the ELD process. Parameters including time, temperature, volume, and pH concentration were optimized for copper deposition. SEM images revealed smooth morphology of neat N6 NFs and copper-coated N6 NFs. EDX spectrum was performed on neat N6 NFs and copper-coated N6 NFs to ensure the qualitative and quantitative presence of copper nanoparticles. Furthermore, advance characterization methods such as FTIR, XPS, water contact angle, and tensile strength were performed to analyze the successful copper deposition on N6 NFs.

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