Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV 2021
DOI: 10.1117/12.2583733
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Self-referenced and self-calibrated MoiréOVL target design and applications

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“…And studies for viewing the spacing of patterns that cannot be considered by optical resolution are being conducted. [25][26][27][28] In addition, there is research 29,30 to reduce TIS using machine learning to improve measurement performance, and research to apply artificial intelligence to semiconductor processes will be an important field for overlay measurement in the future.…”
Section: Discussionmentioning
confidence: 99%
“…And studies for viewing the spacing of patterns that cannot be considered by optical resolution are being conducted. [25][26][27][28] In addition, there is research 29,30 to reduce TIS using machine learning to improve measurement performance, and research to apply artificial intelligence to semiconductor processes will be an important field for overlay measurement in the future.…”
Section: Discussionmentioning
confidence: 99%