Self-formation of single-crystal metal particles driven by inhomogeneous stress in thin films

Ma, Fang; Sun, Haoliang; Zhan, Jingmei; Xu, Ke

doi:10.1016/j.tsf.2011.01.109

Cited by 2 publications

(4 citation statements)

References 27 publications

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“…The average sizes of Cu particles in Figure 5b,c are 369 and 173 nm, respectively. The results in the present work the earlier studies [24,25] demonstrate that the size of Cu particles can be controlled by changing the film’s composition and annealing condition.…”

Section: Resultssupporting

confidence: 85%

“…Therefore, no alloy compound was found in XRD phase analysis and SEM surface morphology observation. Kinetically, the relaxation of the compressive residual stress and thermal stress in the Cu–Zr alloy films resulted in the faceted Cu particles forming on the alloy film surface [24,25].…”

Section: Resultsmentioning

confidence: 99%

“…Therefore, residual compressive stress will be released mainly through the formation of particles. Cu particles are preferentially formed at scratches and grooves on films, indicating that residual stress is an important driving force for the formation of particles [25]. Thermal annealing can activate the release of residual stress in thin films, and it can also induce thermal stress due to the mismatch of thermal expansion coefficients between metal films and soft PI substrates.…”

Section: Resultsmentioning

confidence: 99%

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Discrepancies in the Microstructures of Annealed Cu–Zr Bulk Alloy and Cu–Zr Alloy Films

et al. 2019

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Copper–zirconium bulk alloy and Cu–Zr alloy films are prepared by vacuum smelting and magnetron sputtering, respectively, and subsequently annealing is conducted. Results show that Cu–Zr bulk alloy and alloy films exhibit significantly different microstructure evolution behaviors after annealing due to different microstructures and residual stress states. CuxZr alloy compounds disperse at the grain boundary of Cu grains in as-cast and annealed Cu–Zr bulk alloys. However, unlike bulk alloys, a large number of polyhedral Cu particles are formed on the Cu–Zr thin films’ surface upon thermal annealing. Kinetically, the residual compressive stress in the Cu–Zr films promotes the formation of Cu particles. The influencing factors and the path for mass transport in the formation of the particles are discussed. The large-specific surface area particles/film composite structure has potential applications in Surface-Enhanced Raman Scattering, catalysis, and other fields.

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Section: Resultssupporting

confidence: 85%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

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Discrepancies in the Microstructures of Annealed Cu–Zr Bulk Alloy and Cu–Zr Alloy Films

et al. 2019

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“…This tendency is in agreement with the results of XRD in Figure 1b. This can be explained by taking into account the fact that the higher annealing temperature is easier to activate atom diffusion along grain boundaries and surface driven by the relaxation of high tensile stress [16,17]. Furthermore, compared with Cu–Cr alloy film of different Cr content in Figure 2b,e, it was found that the number of Cu particles increases and the size of Cu particles decreases as the Cr content increases.…”

Section: Resultsmentioning

confidence: 98%

Different Effects of Annealing on Microstructure Evolution and SERS Performance for Cu–Cr Alloy Film and Bulk Alloy

et al. 2019

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Copper–chromium alloy film and Cu–Cr bulk alloy were obtained using magnetron sputtering and vacuum smelting. Experimental results indicated that Cu–Cr bulk alloy and alloy films having different residual stress and atomic diffusion exhibit a significant difference in microstructure evolution behaviors after annealing. Numerous polyhedral Cu particles and dendritic Cr particles precipitated on the surface of annealed Cu–Cr alloy film and as–cast Cu–Cr bulk alloy, respectively. Cu particles were formed under the driving of energy and residual stress in the film. The effect of annealing temperature and Cr content on the size and quantity of Cu particles is discussed. Cr particles precipitated on the bulk alloy due to the low solid solubility of Cr in Cu, and the crystallinity of Cu grains promoted the diffusion of Cr atoms. The surface–enhanced Raman scattering (SERS) intensity of the Cu–14.6%Cr alloy film was obviously higher than that of the Cu–14.2%Cr bulk alloy. The particles/film composite structure possessed the appropriate particle number, surface roughness, and interstitial gap, as opposed to the bulk material, to effectively improve SERS enhancement.

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Self-formation of single-crystal metal particles driven by inhomogeneous stress in thin films

Cited by 2 publications

References 27 publications

Discrepancies in the Microstructures of Annealed Cu–Zr Bulk Alloy and Cu–Zr Alloy Films

Discrepancies in the Microstructures of Annealed Cu–Zr Bulk Alloy and Cu–Zr Alloy Films

Different Effects of Annealing on Microstructure Evolution and SERS Performance for Cu–Cr Alloy Film and Bulk Alloy

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