Discrepancies in the Microstructures of Annealed Cu–Zr Bulk Alloy and Cu–Zr Alloy Films

Abstract

Copper–zirconium bulk alloy and Cu–Zr alloy films are prepared by vacuum smelting and magnetron sputtering, respectively, and subsequently annealing is conducted. Results show that Cu–Zr bulk alloy and alloy films exhibit significantly different microstructure evolution behaviors after annealing due to different microstructures and residual stress states. CuxZr alloy compounds disperse at the grain boundary of Cu grains in as-cast and annealed Cu–Zr bulk alloys. However, unlike bulk alloys, a large number of polyhedral Cu particles are formed on the Cu–Zr thin films’ surface upon thermal annealing. Kinetically, the residual compressive stress in the Cu–Zr films promotes the formation of Cu particles. The influencing factors and the path for mass transport in the formation of the particles are discussed. The large-specific surface area particles/film composite structure has potential applications in Surface-Enhanced Raman Scattering, catalysis, and other fields.

Effects of substrate properties and sputtering methods on self-formation of Ag particles on the Ag–Mo(Zr) alloy films

“…Magnetron sputtering has become an important method for preparing thin films due to its fast speed and good uniformity [12]. The alloy films with low solid solubility prepared by magnetron sputtering, such as Cu-Mn [13], Ag-Ta [14], Cu-Zr [15] and Cu-Ag-Cr [16], are usually in a metastable state, and their atomic diffusion and stress evolution behavior are easily affected by external fields [17]. In particular, as the thickness of the film decreases to the nanometer scale, the atomic diffusion and migration behaviors of the alloy films under the thermal, electric and stress fields become increasingly prominent [18].…”

Effect of Annealing on the Microstructure and SERS Performance of Mo-48.2% Ag Films

“…The Mo-48.2% Ag films were prepared on PI substrates at room temperature, as shown in Figure 3 I. According to previous studies [ 33 , 34 ], the internal stress of the film can be released by forming particles on the film. Therefore, numerous “worm-like” particles were formed on the as-deposited Mo-48.2% Ag films.…”

Different Effects of Annealing on Microstructure Evolution and SERS Performance for Cu–Cr Alloy Film and Bulk Alloy

“…Wo et al [7] have investigated how the precipitation of Cr can strengthen nanocomposite Cr/Cu–Cr multilayer films. Prior work demonstrated that the bulk material and the corresponding thin film material with the same composition might exhibit different microstructure evolution behavior after annealing [8]. The electrical conductivity and tensile strength of a Cu–Cr alloy can be significantly improved after annealing treatment [3].…”