Self-diffusion in lead

Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints

“…The straight lines through the isothermal annealing data points in Fig. 13 yields ∆Hb = 40 kJ/mole, which is in accord with that for grain boundary diffusion in Sn and Pb 12,13 and the interphase diffusion model. 11 To be noted in Fig.…”

Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn–Ag–Cu alloy

“…The activation energy of the extruded alloy was estimated to be about 47 kJ/mol, which is much lower than the activation energy for the lattice selfdiffusion of tin (100-130 kJ/mol) [22,25]. This value was slightly higher than the reported value of 30-40 kJ/mol [26] for the grain boundary diffusion of tin.…”

Effect of Phase Transformation on the Transient Creep Characteristics of Tin Base Alloys

“…6b). These values of activation enthalpies show that the mechanism controlling the transient creep in Pn-Sn alloys are dislocation intersections [9] and grain boundary diffusion in Pb-Sn in the low and high temperature regions, respectively. For Sn-Zn alloys the previous activation enthalpy values [lo] show that the dislocation mechanism may control the transient creep of the test alloys in the transformation temperature region as predicted by Feltham [ 111.…”