Self-assembled crystalline semiconductor optoelectronics on glass and plastic

Saeedi, E.; Kim, S; Parviz, Babak A.

doi:10.1088/0960-1317/18/7/075019

Cited by 50 publications

(42 citation statements)

References 20 publications

(25 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…By this definition, works by Jacobs [10] and Parviz [11], are considered complete selfassembly processes, as they both use fluidic mediums to stochastically transport components to binding locations, employ molten solder to perform component alignment at said binding locations, and finally allow the solder to cool and solidify, thus mechanically and electrically adhering components to the substrate.…”

Section: Nomenclaturementioning

confidence: 99%

Programmable self-assembly for microsystem integration

Hoo

Park

Baskaran

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

View full text Add to dashboard Cite

Department of Electrical Engineering, Department of BioengineeringThis dissertation studies and improves upon template-based self-assembly processes as a suite of techniques for microsystem integration.We first provide an updated definition for microscale self-assembly, and provide a framework that separates all self-assembly processes into three distinct phases which can be independently analyzed.A catalyst-enhanced self-assembly process is then presented, wherein non-participating 'catalyst' components are introduced to a dry-environment batch-assembly process, demonstrating 25 -50% reduction in acceleration needed to trigger part motion and up to four times increase in concentration of parts in motion due to addition of catalysts. The presence of catalytic parts allows stochastic part-to-trap assemblies to be performed at lower accelerations than without, and thus allow said assemblies to be performed further from the acceleration-levels required to free trapped parts; this reduces the probability of part-disassembly, thus improving assembly yield. A model from chemical kinetics theory is adapted for the analysis of this catalyst-enhanced self-assembly process.A variation on the prevalent methodology of driving a stochastic assembly process, using vibrations perpendicular to the assembly surface, is then presented. Using a modified actuator that introduces agitations that are in the plane of the assembly surface, unprecedented control of micropart-motion has been achieved; of note, components can be reliability induced into a "walking mode", where components are moved across surfaces in predetermined directions with a surface-hugging motion. Walking modes enables parts to be moved across surfaces and into binding sites, but do not cause trapped components to disassemble due to the suppression of out-of-plane agitation. Repeatable Finally, the magnetically aided assembly of 01005 surface mount components in a vertical pose is studied by adapting the visual-feedback systems used throughout the thesis work. Electrical performance has been verified, and our process is demonstrated to be competitive against integrated passive elements in terms of area-footprint and capacitive and resistive property-tolerances.

show abstract

Section: Nomenclaturementioning

confidence: 99%

Programmable self-assembly for microsystem integration

Hoo

Park

Baskaran

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

View full text Add to dashboard Cite

show abstract

“…For an active assembly, some of the connections between particles need to be conductive, which can for instance be achieved by diffusion of gold contacts [35]. For larger scale particles (300 µm), integration of electronics inside substrates has already been successfully demonstrated [36]. Figure 6.…”

Section: Self-assembly Of Artificial Elementsmentioning

confidence: 99%

Self-Assembled Three-Dimensional Non-Volatile Memories

et al. 2010

View full text Add to dashboard Cite

Abstract:The continuous increase in capacity of non-volatile data storage systems will lead to bit densities of one bit per atom in 2020. Beyond this point, capacity can be increased by moving into the third dimension. We propose to use self-assembly of nanosized elements, either as a loosely organised associative network or into a cross-point architecture. When using principles requiring electrical connection, we show the need for transistor-based cross-talk isolation. Cross-talk can be avoided by reusing the coincident current magnetic ring core memory architecture invented in 1953. We demonstrate that self-assembly of three-dimensional ring core memories is in principle possible by combining corner lithography and anisotropic etching into single crystal silicon.

show abstract

“…Surface-tension driven self-assembly and hybridassembly of microchips is a topic attracted wide interests. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15] One key aspect of the technology is a well-designed receptor site where the self-alignment process of the selfassembly will take place. The general rule is that the receptor site should be lyophilic (against the lyophobic background) to the self-alignment medium-the liquid medium between the receptor site and the micropart to be assembled, e.g., hydrophilic receptor site if water is used as the self-alignment medium in air [6][7][8][9][10][11] or oleophilic receptor site if adhesive is used as self-alignment medium in water.…”

mentioning

confidence: 99%

“…The general rule is that the receptor site should be lyophilic (against the lyophobic background) to the self-alignment medium-the liquid medium between the receptor site and the micropart to be assembled, e.g., hydrophilic receptor site if water is used as the self-alignment medium in air [6][7][8][9][10][11] or oleophilic receptor site if adhesive is used as self-alignment medium in water. [1][2][3][4][5] In air, solid-edges can also be used as the boundary for the self-alignment process. 12,15 However, the general rule of a lyophilic receptor site still applies.…”

mentioning

confidence: 99%