Self-annealing of electrodeposited copper thin film during room temperature storage

Dong, Wen; Zhang, Jian; Zheng, Jingwu; Sheng, Jing

doi:10.1016/j.matlet.2007.09.029

Cited by 9 publications

(3 citation statements)

References 11 publications

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“…It seems that the Cu-10 sample has smooth and compact morphology surfaces than the other samples-the higher current density resulting in a high crystal nucleation rate that leads to a fine-grain structure. The fine-grained structure leads to a tremendous large amount of grain boundary, resulting in higher resistivity and rigidity [18]. A similar morphology is found in the other's research and it has been plated copper onto aluminum with current density1 A/dm².…”

Section: Experimental Methodssupporting

confidence: 67%

Effect of Current Density on Crystallographic Orientation, and Oxidation Behavior of Copper Plated on Aluminum Substrate

Soegijono

Susetyo²,

Situmorang

et al. 2020

AJAS

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In this work, the electroplating of copper on an aluminum substrate without electrochemical surface treatment was investigated. Electroplating of copper on aluminum substrate was prepared from copper sulfate electrolyte bath with various current densities 1 mA/cm², 3 mA/cm², 10 mA/cm², and 40 mA/cm². The effects of current density on the samples properties were characterized using a different technique. The surface morphology, crystallographic orientation, and corrosion resistance of the Copper film were analyzed using a scanning electron microscope, energy dispersive spectroscopy (SEM-EDS), X-ray diffractometer (XRD), and potentiostat. The samples' surface morphology is changed with different current densities because nucleation is driven by transferring the copper ion rate onto the aluminum substrate. The Cu-10 sample exhibits (111) peak higher and the best corrosion resistance than other samples. Moreover, Cu-1 samples have shifted to positive corrosion voltage (Ecorr) than the other samples.

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Section: Experimental Methodssupporting

confidence: 67%

Effect of Current Density on Crystallographic Orientation, and Oxidation Behavior of Copper Plated on Aluminum Substrate

Soegijono

Susetyo²,

Situmorang

et al. 2020

AJAS

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“…The microhardness values of fine crystals are higher than those of coarse crystals because of more grain boundaries [27]. Therefore, the microhardness gradient of the electroformed copper is achieved due to the variation of microstructure.…”

Section: Microhardnessmentioning

confidence: 99%

Mechanical properties of electroformed copper layers with gradient microstructure

Liu

Zhou

Liu

et al. 2010

Int J Miner Metall Mater

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The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope (OM) and a scanning electron microscope (SEM). The preferred orientations of the layer were characterized by X-ray diffraction (XRD). The mechanical properties were evaluated with a Vicker's hardness tester and a tensile tester. It is found the gradient microstructure consists of two main parts: the outer part (faraway substrate) with columnar crystals and the inner part (nearby substrate) with equiaxed grains. The Cu-(220) preferred orientation increases with the increasing thickness of the copper layer. The test results show that the microhardness of the electroformed copper layer decreases with increasing grain size along the growth direction and presents a gradient distribution. The tensile strength of the outer part of the electroformed copper layer is higher than that of the inner part but at the cost of ductility. Meanwhile, the integral mechanical properties of the electroformed copper with gradient microstructure are significantly improved in comparison with the pure copper deposit.

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“…Recrystallization and grain growth occur at room temperature during a self-annealing phenomenon, unlike the conventional annealing process at high temperatures between 600 °C and 1000 °C (Blaz et al, 1983;Huang et al, 1997;Seah et al, 1999;Hau-Riege and Thompson, 2000;Koo and Yoon, 2001;Militzer et al, 2004;Hasegawa et al, 2006;Stangl et al, 2008). The drastic change in electrical, mechanical, and crystallographic properties was accompanied by a self-annealing phenomenon (Ritzdorf et al, 1998;Brongersma et al, 1999;Ueno et al, 1999;Lagrange et al, 2000;Hara et al, 2003;Dong et al, 2008;Cheng et al, 2010;Huang et al, 2010). Ho et al conducted an in situ investigation of the selfannealing behavior of electroplated copper films with organic additives.…”

Section: Introductionmentioning

confidence: 99%

The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density

et al. 2022

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Electroplated copper was prepared under typical conditions and a high defect density to study the effect of the defects on its self-annealing phenomenon. Two conditions, grain growth and stress relaxation during self-annealing, were analyzed with electron backscattered diffraction and a high-resolution X-ray diffractometer. Abnormal grain growth was observed in both conditions; however, the grown crystal orientation differed. The direction and relative rate at which abnormal grain growth proceeds were specified through textured orientation, and the self-annealing mechanism was studied by observing the residual stress changes over time in the films using the sin2Ψ method.

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Self-annealing of electrodeposited copper thin film during room temperature storage

Cited by 9 publications

References 11 publications

Effect of Current Density on Crystallographic Orientation, and Oxidation Behavior of Copper Plated on Aluminum Substrate

Effect of Current Density on Crystallographic Orientation, and Oxidation Behavior of Copper Plated on Aluminum Substrate

Mechanical properties of electroformed copper layers with gradient microstructure

The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density

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