1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
DOI: 10.1109/ectc.1999.776334
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Self-aligning silicon groove technology platform for the low cost optical module

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Cited by 16 publications
(6 citation statements)
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“…As a result, for practical application, high-precision alignment techniques that do not require micromanipulators should be developed. For example, additional macro patterning of V-grooves via anisotropic etching of the silicon substrate can be used as a self-alignment scheme. , Such a structure will enable easy and accurate alignment by hands. Other passive alignment strategies including optical plugs, ferrules, and fiber-arrays can also be used for precise self-alignment of the chips. These approaches will enable stackable heterointegrated chips to be readily reconfigurable.…”
Section: Other Approaches Of Memristive Technologymentioning
confidence: 99%
“…As a result, for practical application, high-precision alignment techniques that do not require micromanipulators should be developed. For example, additional macro patterning of V-grooves via anisotropic etching of the silicon substrate can be used as a self-alignment scheme. , Such a structure will enable easy and accurate alignment by hands. Other passive alignment strategies including optical plugs, ferrules, and fiber-arrays can also be used for precise self-alignment of the chips. These approaches will enable stackable heterointegrated chips to be readily reconfigurable.…”
Section: Other Approaches Of Memristive Technologymentioning
confidence: 99%
“…A self-constrained mechanism is developed by Choi. When axial force is exerted on a stage, grooves beneath the stage generate internal stress which prevents from moving the stage (Choi et al, 1999). Pyramid and groove mechanism make stacking force under external stress (Slocum & Weber, 2003).…”
Section: Introductionmentioning
confidence: 99%
“…Creating the mechanical stops themselves requires additional etching and deposition steps which increases manufacturing complexity and cost [15]. Alignment accuracy is estimated to be f 3 microns [16].…”
Section: Various Methods Of Flip Chip Assemblymentioning
confidence: 99%