2006 IEEE International Symposium on Power Semiconductor Devices &Amp; IC's
DOI: 10.1109/ispsd.2006.1666081
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Self-aligned High Density Low Voltage P-Channel Trench MOSFET with Ultra Low Resistance and Robust Ruggedness

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Cited by 4 publications
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“…Recently, much attention has been given to low-voltage power metal-oxide-semiconductor field-effect transistor (MOSFET) (PowerMOS) because of the numerous portable devices on the market and related applications. 1) The cost of fabricating a trench PowerMOS is very important. Current studies on the low-voltage trench PowerMOS have focused on the reduction of device pitch by shrinking the design rules, including trench width, source contact size and trenchto-source contact spacing.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, much attention has been given to low-voltage power metal-oxide-semiconductor field-effect transistor (MOSFET) (PowerMOS) because of the numerous portable devices on the market and related applications. 1) The cost of fabricating a trench PowerMOS is very important. Current studies on the low-voltage trench PowerMOS have focused on the reduction of device pitch by shrinking the design rules, including trench width, source contact size and trenchto-source contact spacing.…”
Section: Introductionmentioning
confidence: 99%
“…The trench contact structures with metal plug were reported [1][2][3], and 1.6-2.0 ptm cell pitches were realized [4][5]. The self-aligned contact structures filled with interlayer dielectric above poly-silicon gate in the trench were also presented [6][7][8], and the narrow trench structures around 1.0 ptm pitch were realized in p-channel MOSFET [9] and accumulation-mode MOSFET [10].…”
Section: Introductionmentioning
confidence: 99%