Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

Oberhammer, J.; Niklaus, Frank; Stemme, G.

doi:10.1016/s0924-4247(03)00202-4

Cited by 99 publications

(47 citation statements)

References 14 publications

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“…Common thin-film bonding materials consist of epoxy, polymers, parylene, polyimide, benzocyclobutane (BCB) (Hwang et al 2004, Oberhammer et al 2003, and glass frit, among others. The attraction of these materials is that they are conformal to uneven or wavy geometries and can fill gaps at contact planes.…”

Section: Materials and Constructionmentioning

confidence: 99%

Recent advances in microscale pumping technologies: a review and evaluation

Iverson

Garimella

2008

Microfluid Nanofluid

421

249

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Micropumping has emerged as a critical research area for many electronics and biological applications. A significant driving force underlying this research has been the integration of pumping mechanisms in micro Total Analysis Systems (μTAS) and other multi-functional analysis techniques. Uses in electronics packaging and micromixing and microdosing systems have also capitalized on novel pumping concepts. The present work builds upon a number of existing reviews of micropumping strategies by focusing on the large body of micropump advances reported in the very recent literature. Critical selection criteria are included for pumps and valves to aid in determining the pumping mechanism that is most appropriate for a given application. Important limitations or incompatibilities are also addressed. Quantitative comparisons are provided in graphical and tabular forms.

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Section: Materials and Constructionmentioning

confidence: 99%

Recent advances in microscale pumping technologies: a review and evaluation

Iverson

Garimella

2008

Microfluid Nanofluid

421

249

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“…The first principle is to modify the interface material prior to bonding, defining bonding and non-bonding areas. Examples of patterned bond interface layers include adhesive layers applied only on areas where bonding is desired [3] and bond blocking layers such as gold or platinum defining local non-bonding areas in anodic bonding [4]. The second localized bonding principle is to use heat triggered bonding methods and to localize the heat to the desired areas of the bond interface.…”

Section: Introductionmentioning

confidence: 99%

Localized removal of the Au–Si eutectic bonding layer for the selective release of microstructures

Gradin¹,

Braun²,

Stemme³

et al. 2009

J. Micromech. Microeng.

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This paper presents and investigates a novel technique for the footprint and thickness-independent selective release of Au-Si eutectically bonded microstructures through the localized removal of their eutectic bond interface. The technique is based on the electrochemical removal of the gold in the eutectic layer and the selectivity is provided by patterning the eutectic layer and by proper electrical connection or isolation of the areas to be etched or removed, respectively. The gold removal results in a porous silicon layer, acting similar to standard etch holes in a subsequent sacrificial release etching. The paper presents the principle and the design requirements of the technique. First test devices were fabricated and the method successfully demonstrated. Furthermore, the paper investigates the release mechanism and the effects of different gold layouts on both the eutectic bonding and the release procedure.

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“…This paper investigates the high strength bonding of wafers to form microfluidic channels using photosensitive BCB. Most literatures report the bonding of BCB with a wafer bonder under vacuum conditions to prevent oxidation of the cyclobutene reactant group (Hwang et al 2004;Lee et al 2004;Oberhammer et al 2003;Polyakov et al 2005;Seok et al 2006;Turmezei et al 2003), but the wafer bonding machine is an expensive piece of equipment. There is a report regarding the bonding of patterned BCB without vacuum in a flip chip bonder (Jourdain et al 2005), but the BCB only occupied a small amount of the wafer, the bonding was processed after dicing, and the flip chip bonder is also expensive.…”

Section: Introductionmentioning

confidence: 99%

Wafer-level BCB bonding using a thermal press for microfluidics

2008

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Benzocyclobutene (BCB) is a thermosetting polymer that can form microfluidics and bond top and bottom layers of the microfluidics at the same time, and yields high repeatability and high bonding strength. This paper reports using photosensitive BCB to fabricate microfluidics and to bond with a thermal press for 4 in. wafers. By optimizing the parameters for pattern development and using a three-stage temperature and pressure increment BCB bonding, we realize the whole wafer glassSi or glass-glass bonding in thermal press without any crack. The wafer-level bonding shows a bonding percentage above 70%, a tensile stress above 4.94 MPa, and a bonding repeatability over 95%. Furthermore, the bonding is compatible with thick electrode integration, that microfluidics with 380 nm thick electrodes underneath can be well-bonded. Our bonding method much reduces the cost compared with bonding BCB in a wafer bonding machine.

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Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

Cited by 99 publications

References 14 publications

Recent advances in microscale pumping technologies: a review and evaluation

Recent advances in microscale pumping technologies: a review and evaluation

Localized removal of the Au–Si eutectic bonding layer for the selective release of microstructures

Wafer-level BCB bonding using a thermal press for microfluidics

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