2016
DOI: 10.3390/nano6060108
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Selective Plasma Etching of Polymeric Substrates for Advanced Applications

Abstract: In today’s nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interactions with precise bonds in materials and later cause etching. This typically occurs based on material stability, which leads to preferential etching of one material over other. This process is especially interesting … Show more

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Cited by 106 publications
(71 citation statements)
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“…Similarly, preferential etching of polymer over the inorganic phase has also been applied in other research fields. [32][33][34][35] For example, He/O 2 atmospheric pressure plasma was used to selectively etch cellulose fibers and any internal sizing agents, the inorganic fillers (calcite) were exposed and the micro-and nano-scale topography was enhanced, this process was a prerequisite for obtaining superhydrophobic paper. [33] Low pressure O 2 plasma was used to selective etch glass filled polyphenolics, the glass fillers were uncovered and tracking resistance properties were improved.…”
Section: Sem and Xps Analysismentioning
confidence: 99%
“…Similarly, preferential etching of polymer over the inorganic phase has also been applied in other research fields. [32][33][34][35] For example, He/O 2 atmospheric pressure plasma was used to selectively etch cellulose fibers and any internal sizing agents, the inorganic fillers (calcite) were exposed and the micro-and nano-scale topography was enhanced, this process was a prerequisite for obtaining superhydrophobic paper. [33] Low pressure O 2 plasma was used to selective etch glass filled polyphenolics, the glass fillers were uncovered and tracking resistance properties were improved.…”
Section: Sem and Xps Analysismentioning
confidence: 99%
“…In this case, different types of etching are required for the fabrication of electrical bias running through the polyimide layer [5]. Several studies have been published on the characterization of polyimide dry etching using different plasma chemistries, etching methods, and parameters [6][7][8]. However, the capability and availability of plasma machine in semiconductor is a factor but this was not become an excuse to have a reliable ball shear data during evaluation of the device.…”
Section: Introductionmentioning
confidence: 99%
“…[10][11][12][13][14] Some other applications of plasma modification include gas separation, oil-water separation, and self-cleaning and adhesion of surfaces, to name a few. [15][16][17][18][19][20][21][22][23] Polymeric nanofibers are currently one of the most popular and attractive topics for researchers and industry due to their unique physical and chemical characteristics. The nanofibers play a crucial role in potential applications, especially in the filtration area.…”
Section: Introductionmentioning
confidence: 99%