Selective Oxidation of Si in the Presence of W and Wn

Abstract

In various device fabrication processes, such as in metal gate and low resistance word line fabrication, one needs to be able to oxidize Si without oxidizing metals present. We developed such a process using a combination of H2 and O2 in the H2 rich regime. The process developed is safe and is production worthy with excellent uniformity.When carrying out the selective oxidation using H2/O2, a high Si oxidation rate is preferred which requires a high oxygen concentration. At the same time, the increase in metal sheet resistance, if any, must be small. We found that with an oxygen concentration as high as 20%, the increase in W sheet resistance is small. We present data on the oxidation rate of Si under different conditions as well as the selectivity of the process with respect to W and WN.