1998
DOI: 10.1143/jjap.37.l845
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Selective Area Growth of GaN Using Tungsten Mask by Metalorganic Vapor Phase Epitaxy

Abstract: We studied selective area growth (SAG) of GaN using a tungsten (W) mask with an atmospheric metalorganic vapor phase epitaxy (MOVPE) system. No GaN polycrystals were observed on the W mask regions, and the selectivity of GaN growth on window regions proved to be excellent. The GaN stripes developed into different shapes depending on the direction of stripe mask patterns. If the stripe was along <1120>, a triangular shape with {1101} facets was formed. If the stripe was al… Show more

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Cited by 36 publications
(21 citation statements)
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“…GaN growth is initiated only on the Ga 2 O 3 template and results in a lateral growth over the AlO x stripe. W was used in place of SiO 2 or silicon nitride as mask and, at first sight, leads to similar results, although W reacts somehow with ammonia at the growth temperature [113,114]. However, the tilting of the c-axis direction is smaller when using a W mask instead of SiO 2 [78,114].…”
Section: New Developmentsmentioning
confidence: 85%
“…GaN growth is initiated only on the Ga 2 O 3 template and results in a lateral growth over the AlO x stripe. W was used in place of SiO 2 or silicon nitride as mask and, at first sight, leads to similar results, although W reacts somehow with ammonia at the growth temperature [113,114]. However, the tilting of the c-axis direction is smaller when using a W mask instead of SiO 2 [78,114].…”
Section: New Developmentsmentioning
confidence: 85%
“…After 15 mm distance to the substrate facet growth stops and only perfect h0001i growth occurs both between and above the tungsten stripes. Accordingly, at the sample surface no influence of the mask position is detected in the luminescence, showing the main excitonic line at 357 nm [4,5]. This is directly visualized in Fig.…”
mentioning
confidence: 56%
“…The ELO approach consists of masking parts of the defective crystalline substrate GaN "seed" layer with an amorphous layer preventing the dislocations from propagating into the overlayer during subsequent re-growth. While impurities are unintentional incorporated in the initial stages of ELOG, the biaxial strain and defect concentration are reduced on the top of the mask [2][3][4][5].The maskless heteroepitaxy on pre-patterned substrates has been proven successful in achieving crack free AlGaN on trench-patterned GaN/sapphire substrates [6,7]. …”
mentioning
confidence: 99%
“…In the previous work, we succeeded in the SAG of GaN using W masks by MOVPE for the first time [12]. In this work, we compare the W mask and the SiO 2 mask in terms of shape and crystalline quality of the SAG-GaN.…”
Section: Resultsmentioning
confidence: 99%
“…In a previous study, we attempted the SAG of GaN using tungsten (W) masks by metalorganic vapor phase epitaxy (MOVPE) for the first time [12]. In this study, we compare the SAG of GaN using W mask to that of SiO 2 mask by MOVPE by means of scanning electron microscope (SEM) and cathodoluminescence (CL) measurements.…”
Section: Introductionmentioning
confidence: 99%