Al₂O₃–Al₂O₃ and Al₂O₃–Ti Solder Joints—Influence of Ceramic Metallization and Thermal Pretreatment on Joint Properties

Abstract

Ti solder joints intended for space applications were realized by applying metallic multilayers both on Ti and on polycrystalline Al 2 O 3 substrates to ensure wetting during the soldering process. The eutectic Au-12Ge (wt%) alloy with a melting point of 361°C was used as solder material and two different multilayer systems on the ceramic (Cr-Ni/Ti-W/Au, Ti/Pt/Au) were investigated. The influence of different thermal pretreatments of the Al 2 O 3 plates on the multilayer properties, the interface reactions during soldering and the mechanical properties were studied using Glow-Discharge Optical Emission Spectroscopy (GDOES), X-ray Photoelectron Spectroscopy (XPS), Scanning Electron Microscopy (SEM) and a shear test device. It is shown that joints with a good quality can be produced at a soldering temperature of 400°C, whereas their properties and fracture behavior are strongly dependent on the metallization layer properties and the thermal pretreatments.

The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

“…Other materials under development are Zn-Al eutectic systems alloyed with Mg, Ge, Ga, Sn or Bi, Sb-Sn, and Au-Sn-X or Au-Ge-X systems. Au based solders are already in use [16], but, because of their high price, for very specific purposes only. A typical example is in the space industry, where the cost is not one of the key issues.…”

“…On the other hand, the price of such alloys is very prohibitive and therefore these materials are suitable just for very specific niche applications, where the cost can be justified. A typical example is the space industry [16,26]. Calculations using a suitable thermodynamic database can be used to design the composition which would e.g.…”

Direct Brazing of Al/Al$lt;inf$gt;2$lt;/inf$gt;O$lt;inf$gt;3$lt;/inf$gt; not Based on Wettability of Molten Metal

“…金结合的一种连接方法, 对陶瓷而言, 钎焊则是最 主要的连接方法。在现有的钎焊理论中, 润湿是钎 焊的基础, 作为钎料的金属熔液只有润湿基体(金 属、陶瓷)才能实现钎焊连接。但是金属熔液不能润 湿常用的工程陶瓷(Al 2 O 3 、AlN 等), 只能采用在陶 瓷表面上烧结或镀覆 [1][2][3] 能与其反应的活性金属层 的金属化方法, 或在钎料中加入活性金属组分的活 性钎料钎焊法 [4][5][6][7] , 使陶瓷表面形成可被金属润湿 的反应过渡层而实现钎焊连接, 因而现有的陶瓷 钎焊接头中都存在不同程度影响接头性能的反应 过渡层。 Al 2 O 3 因具有许多优异的性能而得到广泛应用, 如在电子工业中, 作为封装基片需要将 Al 2 O 3 与金 属如 Cu [8][9] 、Al [10] 、Ti [11] 等进行钎焊连接。为了使 金属钎料润湿 Al 2 O 3 , 一般只能采用具有脆性反应 过渡层的方式。例如, 在 Al 2 O 3 直接覆铜法中 [8] , Al [12][13][14][15][16][17] ,…”

Microstructure Evolution of Alumina/Alumina Joint Bonded by Boron Oxide–Alumina Nonmetal Powder Interlayer

“…The most commonly used method is active brazing using metal interlayer. With the help of metal interlayer such as CuTi, CuZr, and AgCuTi, the alumina can be joined successfully to itself or metals. However, residual stress tends to generate in the joint due to the mismatch of the coefficient of thermal expansion between ceramic and AgCuTi, which severely degrades the quality of the joint.…”