Scan Power Reduction for Linear Test Compression Schemes Through Seed Selection

Abstract

XOR network-based on-chip test compression schemes have been widely employed in large industrial scan designs due to their high compression ratio and efficient decompression mechanism. Nevertheless, such a scheme necessitates high unspecified bit ratios in the original test cubes, resulting in quite significant difficulties in preprocessing test cubes for scan power reduction. The linear mapping from the original cubes to the compressed seeds typically provides extra degrees of flexibility as multiple seeds may reconstruct the test cube. Due to the highly divergent power impact of distinct seeds though, appreciable power reductions in the decompressed test data can be attained through the pinpointing of the power-optimal seeds during the compression phase. This work explores the aforementioned flexibility in the seed space, and outlines a mathematical and algorithmic framework for a poweraware linear test compression scheme. The proposed technique incurs no hardware overhead over the traditional linear compression scheme; it can be easily embedded furthermore into the industrial test compaction/compression flow. Experimental results confirm that the proposed technique delivers significant scan power reduction with negligible impact on the compression ratio.

A scan shifting method based on clock gating of multiple groups for low power scan testing

“…Although the capture power is one of the serious problems, it has smaller power consumption than the shifting power. This is because most of switching activities is due to the transitions in the scan chain when loading and unloading the test patterns [18].…”

Thermal-Aware Test Data Compression Using Dictionary Based Coding

“…In recent times, some works have addressed the problem of high power consumption in test data compression schemes [5], [6]. However, it may be noted that, power minimization may reduce overall temperature of a circuit, but, does not necessarily minimize peak temperature, which causes local hotspot due to non-uniform spatial power distribution in the circuit and hence permanent damage of it.…”