2018
DOI: 10.1016/j.apsusc.2017.09.172
|View full text |Cite
|
Sign up to set email alerts
|

Scalable fabrication of flexible multi-level nanoimprinting molds with uniform heights via a ‘top-to-bottom’ level patterning sequence

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2019
2019
2021
2021

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 15 publications
0
1
0
Order By: Relevance
“…As the size of the devices decreases to nanoscale, some conventional techniques, with limitations set by optical diffraction and scattering, cannot fulfill the requirements. Nanoimprinting is a revolutionary approach, which not only has demonstrated being of high resolution up to nanometer feature size but also provided low cost and high throughput nanopatterns over a large area, becoming a promising candidate for the next generation lithography technologies [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17]. This technique is developed by pressing a hard master mold to penetrate into the surface of a substrate such as on a soft polymer originally [10,11] then metals using diamond or SiC molds [15][16][17] and carbon nanotubes (CNTs) [18][19][20] which can transfer high-density patterns into metal thin films.…”
Section: Introductionmentioning
confidence: 99%
“…As the size of the devices decreases to nanoscale, some conventional techniques, with limitations set by optical diffraction and scattering, cannot fulfill the requirements. Nanoimprinting is a revolutionary approach, which not only has demonstrated being of high resolution up to nanometer feature size but also provided low cost and high throughput nanopatterns over a large area, becoming a promising candidate for the next generation lithography technologies [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17]. This technique is developed by pressing a hard master mold to penetrate into the surface of a substrate such as on a soft polymer originally [10,11] then metals using diamond or SiC molds [15][16][17] and carbon nanotubes (CNTs) [18][19][20] which can transfer high-density patterns into metal thin films.…”
Section: Introductionmentioning
confidence: 99%