2009
DOI: 10.1109/tmtt.2008.2011208
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Scalable Equivalent Circuit FET Model for MMIC Design Identified Through FW-EM Analyses

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Cited by 58 publications
(59 citation statements)
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“…In this context, coupling phenomena associated with the doped semiconductor substrate are not taken into account, as they have been found generally negligible [13]- [16]. This assumption is further confirmed by the experimental validation provided in Section IV.…”
Section: Modeling and Analytical Identification Of The Device Lummentioning
confidence: 68%
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“…In this context, coupling phenomena associated with the doped semiconductor substrate are not taken into account, as they have been found generally negligible [13]- [16]. This assumption is further confirmed by the experimental validation provided in Section IV.…”
Section: Modeling and Analytical Identification Of The Device Lummentioning
confidence: 68%
“…3(c). The matrix associated with this representation can be expressed by (11) where (12) Starting from , the elements and can be extracted by the linear regression of (13) and…”
Section: Finger Region Parameter Extractionmentioning
confidence: 99%
“…1 shows a conventional FET model: the linear extrinsic parasitic network accounts for metallization and dielectric losses as well as for the associated inductive and capacitive effects. The characterization of the parasitic part can be carried out by means of lumped elements [5] or by performing device layout electromagnetic simulations [6]- [7]. The active area corresponding to the intrinsic device is composed of two parts [3] which can be considered strictly in parallel: a "capacitive core" which accounts for the nonlinear dynamic phenomena and a "resistive core" responsible for the dc and low-frequency I\V device behavior.…”
Section: The Adopted Design Approachmentioning
confidence: 99%
“…The determination and subsequent de-embedding of the extrinsic elements is essential to access the performance of the intrinsic FET that is not directly measurable, since the intrinsic section of the FET is experimentally inaccessible. The extrinsic elements are usually determined using "cold" S-parameter measurements (V DS = 0 V, i.e., passive device) [10][11][12][13][14][15][16], passive test structures [13][14][15][16][17], and full-wave electromagnetic simulations [18][19][20][21]. In practice, the "cold" approach is the most used, since it does not require additional dummy structures or detailed information about the FET layout.…”
Section: Introductionmentioning
confidence: 99%