Proceedings of the IEEE 2013 Custom Integrated Circuits Conference 2013
DOI: 10.1109/cicc.2013.6658492
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Scalable behavior modeling for 3D field-programmable ESD protection structures

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Cited by 3 publications
(2 citation statements)
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“…This is because ESD protection involves very complex multi-coupling effects, i.e., the electro-thermal-transient-materials-process-device-circuit-layout coupling effect [39,53]. ESD device behavior modeling has been successfully used for ESD protection design simulation, where accurate ESD device models can be developed from ESD test data, but only for given ESD devices [54,55]. The development of physics-based compact ESD device models has been hindered by many technical complexities.…”
Section: Soic Esd Modeling and Simulation Challengesmentioning
confidence: 99%
“…This is because ESD protection involves very complex multi-coupling effects, i.e., the electro-thermal-transient-materials-process-device-circuit-layout coupling effect [39,53]. ESD device behavior modeling has been successfully used for ESD protection design simulation, where accurate ESD device models can be developed from ESD test data, but only for given ESD devices [54,55]. The development of physics-based compact ESD device models has been hindered by many technical complexities.…”
Section: Soic Esd Modeling and Simulation Challengesmentioning
confidence: 99%
“…Whole-chip ESD protection circuit simulation is a challenging IC design problem due to lack of accurate ESD device models and suitable of full-chip ESD circuit simulation tools [1][2][3][4]. Consequently, the trial-and-error approaches still dominate in ESD protection design practice.…”
Section: Introduction To Hv Esd Protection Designmentioning
confidence: 99%