Saw and Polishing Damage in Silicon Crystal Wafers by X-Ray Topography

Saccocio, Edward J.; McKeown, W.

doi:10.1063/1.1709985

Cited by 7 publications

(1 citation statement)

References 6 publications

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“…In the previous studies of mechanically induced surface damage in Si, the depth of damage has been measured using a variety of techniques, e.g., the x -r a y rocking-curve method (6), the etching rate method (8), the photomagnetoelectric method (6), the photoconductivity decay method (6), step-etching with x -r a y topography (1,2,16), transmission electron microscopy (5,7), metallographic taper-sectioning method (17), etc. Only the last three methods can show the actual damage distribution.…”

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Effect of Lubricant Environments on Saw Damage in Si Wafers

Kuan

Shih

Vechten

et al. 1980

J. Electrochem. Soc.

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The effect of lubricant environments on the structure of the surface damage induced in Si during the wafer sawing process was tested for four different lubricants: water, methyl silane solution, Kleenzol B, and dielectric oil. The nature of the saw damage was characterized by transmission electron microscopy and the depth profile of the damage determined by a taper‐sectioning method. The results showed that the number and depth of surface damage is sensitive to the chemical nature of the saw lubricant. Lubricants that are good catalysts for breaking Si bonds can induce more fracture cleavage and produce less surface damage. Lubricants that can dampen more effectively the out‐of‐plane blade vibration can also reduce the surface damage. The chemomechanical effect of the lubricant environment was also tested by applying different potentials on Si crystal during the sawing. Correlation between the applied potential and the depth of damage in the dielectric oil environment was observed and possible mechanisms involved were discussed.

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Effect of Lubricant Environments on Saw Damage in Si Wafers

Kuan

Shih

Vechten

et al. 1980

J. Electrochem. Soc.

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Messung von Rockingkurven eines polierten CaF₂‐Kristalls

Dietrich

Förster

Böttger

1977

Cryst Res and Technol

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Es wird uber die Messung von Rockingkurven an einem polierten CaF,-Kristall nach schrittweiser Abtragung dunner Oberfliichenschichten berichtet. Die Auswertung fiihrt zu einer Erweiterung des Raetherschen Modells polierter Oberflachen durch Annahme eines elastisch deformierten Gebietes unterhalb der durch die Politur erzeugten mosaikkristallinen Schicht.It is reported on the measurement of rocking-curves of a polished CaF, crystal after stepwise removing of thin surface-layers. The discussion leads to a completion of the Raetherinodel of polished surfaces by assunling an elastic deformed region under the mosaic-crystalline layer produced by the polishing process.

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