Sacrificial Materials and Release Etchants for Metal MEMS That Reduce or Eliminate Hydrogen-Induced Residual Stress Change

Ni, Longchang; Boer, Maarten P. de

doi:10.1109/jmems.2021.3069397

Cited by 6 publications

(2 citation statements)

References 48 publications

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“…While there are various methods to measure the film stress like XRD [15][16][17][18][19], PL Raman, wafer curvature technique [20], MEMS test structure [21,22], passive strain sensors [23], we observed that all of the methods are not equivalent. XRD measures the microstress in a grain of poly-crystalline material.…”

Section: Strain Gauge Design For Thin Film Stress Measurementmentioning

confidence: 86%

Residual stress tuning in UV- LIGA fabricated microstructures using deposition temperature and reverse pulse plating

Agrawal¹,

Mitra²

2023

J. Micromech. Microeng.

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This paper utilizes pulse reverse plating to control the residual stress in electroplated Copper MEMS structures. The residual stress plays a significant role in many MEMS devices and control (not just minimization) over it is desirable. We have tuned the stress either compressive or tensile for different plating parameters, without utilizing any additives in the bath or annealing in the process. We demonstrate the use of this technique using a UV-LIGA fabricated microstrain gauge, that is also utilized to measure the stress. We show that the stress can be tuned from a value of 364 MPa to -194 MPa by varying the pulse plating parameters like ratio of forward/reverse time and temperature.

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Section: Strain Gauge Design For Thin Film Stress Measurementmentioning

confidence: 86%

Residual stress tuning in UV- LIGA fabricated microstructures using deposition temperature and reverse pulse plating

Agrawal¹,

Mitra²

2023

J. Micromech. Microeng.

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“…It is found that the residual stress has an important effect on the stiffness of the film, significantly changing the first natural frequency of PMUT. BIE Xiaorui et al systematically studied the frequency drift law of MSRA in the temperature range of 0 ~50°C through finite element simulation [15] . In addition, the influence of changes in package structural parameters and material properties on MSRA frequency drift is analyzed.…”

Section: Introductionmentioning

confidence: 99%

Finite element simulation and experiment of residual stress evolution in MEMS structures

Wen,

Chen,

Huang

et al. 2024

J. Phys.: Conf. Ser.

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The MEMS device structure is usually formed by the combination of thick film and thin film deposition of many different materials, and the residual stress generated in the process of integration/superposition of different materials has a significant impact on the performance and reliability of the device.In this study, a test structure of a multilayer thin film was designed and processed. Based on this, finite element modeling analysis and reliability experiment, analyze the evolution of residual stress and construct the corresponding theoretical analysis model. The finite element modeling analysis can characterize the evolution and distribution laws of residual stress. The reliability experiment is mainly by carrying out the temperature shock experiment, and measuring the resistance value, resonance frequency and the surface morphology of the device, so as to better reflect the change of residual stress. Through this study, the resonant frequency and surface morphology of the device can reflect the residual stress of the device, which provides help for the test and analysis of the residual stress. To a certain extent, it can help reduce the harm caused by the residual stress in the design and manufacturing process, and improve the performance and reliability of MEMS devices.

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Safe working condition and optimal dimension of the electrothermal V-shaped actuator

Hoang

Pham

2022

Microsyst Technol

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Sacrificial Materials and Release Etchants for Metal MEMS That Reduce or Eliminate Hydrogen-Induced Residual Stress Change

Cited by 6 publications

References 48 publications

Residual stress tuning in UV- LIGA fabricated microstructures using deposition temperature and reverse pulse plating

Residual stress tuning in UV- LIGA fabricated microstructures using deposition temperature and reverse pulse plating

Finite element simulation and experiment of residual stress evolution in MEMS structures

Safe working condition and optimal dimension of the electrothermal V-shaped actuator

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