2014 Lester Eastman Conference on High Performance Devices (LEC) 2014
DOI: 10.1109/lec.2014.6951568
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S4-P7: Low-temperature hydrophobic wafer bonding for 1200V, 25A bi-directional Si UMOS IGBTs

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“…Comfortingly, monolithic integrated bidirectional switches would be considerable alternatives for overcoming the shortcomings of the above BPS composed of discrete devices. [19][20][21][22][23][24][25][26] In particular, galliumnitride (GaN) high electron mobility transistor (HEMT) 27) BPSs with single-gate half-controlled capabilities [28][29][30][31][32][33] and dual gate fully-controlled capabilities [34][35][36][37][38][39][40][41] have the opportunity to further improve the performance of the abovementioned power electronics applications. It is worth noting that the reported dual gate fully-controlled BPSs [34][35][36][37][38][39][40][41] show high turn-on voltage (V ON ) and low threshold voltage (V TH ) so that diode modes and bi-directional conduction mode result in high power consumption.…”
Section: Introductionmentioning
confidence: 99%
“…Comfortingly, monolithic integrated bidirectional switches would be considerable alternatives for overcoming the shortcomings of the above BPS composed of discrete devices. [19][20][21][22][23][24][25][26] In particular, galliumnitride (GaN) high electron mobility transistor (HEMT) 27) BPSs with single-gate half-controlled capabilities [28][29][30][31][32][33] and dual gate fully-controlled capabilities [34][35][36][37][38][39][40][41] have the opportunity to further improve the performance of the abovementioned power electronics applications. It is worth noting that the reported dual gate fully-controlled BPSs [34][35][36][37][38][39][40][41] show high turn-on voltage (V ON ) and low threshold voltage (V TH ) so that diode modes and bi-directional conduction mode result in high power consumption.…”
Section: Introductionmentioning
confidence: 99%